Method for flip-chip bonding using anisotropic adhesive polymer
AssigneeResearch & Business Foundation Sungkyunkwan University
InventorsTae Il KIM, Ju Seung LEE
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Abstract
The present invention discloses flip-chip bonding method using an anisotropic adhesive polymer. The method includes applying an adhesive polymer solution containing metal particles dispersed therein onto a circuit substrate to form an adhesive polymer layer such that the adhesive polymer layer covers the metal particles; drying the adhesive polymer layer; and positioning an electronic element to be electrically connected to the circuit substrate on the dried adhesive polymer layer and causing dewetting of the polymer from the metal particles.
Claims24
A structure for flip-chip bonding, the structure allowing an adhesive polymer to be dewettted, the structure comprising:
- a circuit substrate;
- an anisotropic adhesive polymer layer applied on the circuit substrate;
- and
- metal particles dispersed in the adhesive polymer layer,
- wherein an effective interfacial potential of the adhesive polymer at a position corresponding to the metal particle has a metastable state, and the adhesive polymer at the position corresponding to the metal particle has a thickness change by an external force applied thereto, such that the adhesive polymer is dewetted from the metal particle.
A structure for flip-chip bonding, the structure allowing an adhesive polymer to be dewettted, the structure comprising:
- a circuit substrate;
- a relief electrode partially formed on the circuit substrate;
- and
- an anisotropic adhesive polymer layer applied on the circuit substrate and the relief electrode,
- wherein an effective interfacial potential of the adhesive polymer at a position corresponding to the relief electrode has a metastable state, and the adhesive polymer at the position corresponding to the relief electrode has a thickness change by an external force applied thereto, such that the adhesive polymer is dewetted from the relief electrode.
Dependencies are inferred from the claim text.