Conductive resin composition, method for manufacturing electronic component using same, bonding method, bonding structure, and electronic component
AssigneeMurata Manufacturing Co., Ltd.
InventorsTomoaki Onoue, Masaaki Hirayama, Yoshiki Aburatani
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Abstract
A conductive resin composition which includes (a) a curable resin and (b) hard spherical carbon formed by coating the surface of a spherical base carbon particle with fine carbon particles and/or pitch-derived fine carbon pieces is used to electrically bond two conductive elements. The conductive resin composition is supplied to a space between areas of at least two works respectively having the areas to be electrically connected to each other, and the conductive resin composition is cured while applying a pressure between the areas.
Claims10
A bonding structure bonding one conductor to the other conductor so as to be electrically connected, comprising a pair of conductors with a cured conductive resin composition comprising (a) a cured resin and (b) hard spherical carbon having an average particle diameter of 10 μm or less, the hard spherical carbon itself having a compression strength of 200 MPa or more, and the hard spherical carbon comprising solid spherical carbon particles whose surface is coated with fine carbon particles or pitch-derived fine carbon pieces or both interposed between the conductors, wherein the hard spherical carbon in the conductive resin composition is hard amorphous carbon and has a higher hardness than either member of the pair of conductors, and wherein a part of the solid spherical carbon particles and the fine carbon on the surface of the solid spherical carbon particles are incorporated into a surface of both conductors.
Dependencies are inferred from the claim text.