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US 9,928,934 B2Granted
Curable composition for electronic component and connection structure
AssigneeSekisui Chemical Co., Ltd.
InventorsHideaki Ishizawa, Takashi Kubota
Life of this patent
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Abstract
Provided is a curable composition for an electronic component that can be quickly cured and furthermore can have increased storage stability. The curable composition for an electronic component according to the present invention contains an epoxy compound, an anionic curing agent, a flux, and a basic compound excluding the anionic curing agent.
Claims8
A curable composition for an electronic component, containing an epoxy compound, an anionic curing agent, a flux, a basic compound that is not an anionic curing agent in the curable composition for an electronic component, and a conductive particle,
- the basic compound being a primary amine having an aromatic skeleton,
- the content of the basic compound being 0.1 parts by weight or more and 10 parts by weight or less relative to 100 parts by weight of the epoxy compound.
Dependencies are inferred from the claim text.