H05K 2201/0224
Conductive particles having an insulating coating
H05K2201/0224 (Conductive particles having an insulating coating) appears on 121 US grants and 175 published applications in this corpus.
Search patents in H05K- Granted patents
- 121
- Published applications
- 175
- Assignees
- 102
- Inventors
- 418
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 0 |
| 2003 | 1 | 1 |
| 2004 | 1 | 11 |
| 2005 | 2 | 8 |
| 2006 | 2 | 11 |
| 2007 | 7 | 12 |
| 2008 | 3 | 11 |
| 2009 | 8 | 12 |
| 2010 | 9 | 19 |
| 2011 | 9 | 10 |
| 2012 | 11 | 14 |
| 2013 | 5 | 7 |
| 2014 | 5 | 6 |
| 2015 | 4 | 9 |
| 2016 | 6 | 7 |
| 2017 | 7 | 4 |
| 2018 | 3 | 5 |
| 2019 | 5 | 5 |
| 2020 | 1 | 8 |
| 2021 | 5 | 3 |
| 2022 | 7 | 7 |
| 2023 | 4 | 2 |
| 2024 | 3 | 1 |
| 2025 | 1 | 2 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electrical component and method of forming same4 Aug 2026US 12,701,657 B2Medtronic, Inc.
- Coating layer disposed on a plurality of conductive particles between a display panel and a printed circuit board17 Jun 2025US 12,336,396 B2Samsung Display Co., Ltd.
- Adhesive conductive paste26 Nov 2024US 12,152,169 B2Daicel Corporation
- Electro-optical device comprising a plurality of terminals having a plurality of recessed portions including first and second recessed portions and electronic apparatus24 Sep 2024US 12,099,277 B2Seiko Epson Corporation
- Stable PCB for solid state light source application23 Jan 2024US 11,882,651 B2Signify Holding B. V.
- Member for forming wiring, method for forming wiring layer using member for forming wiring, and formed wiring member1 May 2025US 2025/0142722 A1
- Architected liquid metal networks and processes of making and using same30 Jan 2025US 2025/0040041 A1Government of the United States as Represented by the Secretary of the Air Force
- Method for Producing a Solder Connection and Assembly with a Solder Connection19 Dec 2024US 2024/0416443 A1Siemens Aktiengesellschaft
- Electro-optical device and electronic apparatus5 Oct 2023US 2023/0314882 A1Seiko Epson Corporation
- Ink for screen printing8 Jun 2023US 2023/0174812 A1Daicel Corporation
Most cited
By later US patents
- Anisotropically electroconductive adhesive and adhesive film63US 5,965,064 ASony Chemicals Corp. · 1999
- Anisotropic conductive adhesive compositions56US 5,162,087 AChemitech, Inc. · 1992
- Directionally conductive polymer43US 5,213,715 AWestern Digital Corporation · 1993
- Light source module, method of fabricating the same, and display device having the light source module40US 7,909,480 B2Samsung Electronics Co., Ltd. · 2011
- Conductive bonding agent and a conductive connecting method37US 5,180,888 ACasio Computer Co., Ltd. · 1993