Member for forming wiring, method for forming wiring layer using member for forming wiring, and formed wiring member
OwnerMasashi OHKOSHI, Yuka ITOH +6inventors
InventorsMasashi OHKOSHI, Yuka ITOH, Shunsuke TAKAGI, Kunihiko AKAI, Nozomu TAKANO, Hiroyuki IZAWA, Daisuke FUJIMOTO, Tomohiko KOTAKE
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Abstract
A member 1 for forming wiring includes an adhesive layer 10 and a metal layer 20. The adhesive layer 10 is composed of an adhesive composition containing conductive particles 12 and a thermosetting component. The metal layer 20 is disposed on the adhesive layer 10. In such a member 1 for forming wiring, the adhesive layer contains an epoxy resin and a phenolic resin, as the thermosetting component.
Claims20
A member for forming wiring, comprising:
- a metal layer;
- and
- an adhesive layer disposed on the metal layer,
- wherein the adhesive layer contains conductive particles, an epoxy resin, and a phenolic resin.
A member for forming wiring, comprising:
- a metal layer;
- and
- an adhesive layer disposed on the metal layer,
- wherein the adhesive layer contains conductive particles and a thermosetting component, and
- the adhesive layer has a reaction rate of 90% or less when heated at 180° C. for 5 minutes.
A member for forming wiring in which an adhesive layer containing conductive particles and a thermosetting component, and a metal layer are provided separately, and the adhesive layer is adherable to the metal layer at the point of use,
- wherein the adhesive layer contains an epoxy resin and a phenolic resin, as the thermosetting component.
A member for forming wiring in which an adhesive layer containing conductive particles and a thermosetting component, and a metal layer are provided separately, and the adhesive layer is adherable to the metal layer at the point of use,
- wherein the adhesive layer has a reaction rate of 90% or less when heated at 180° C. for 5 minutes.
Dependencies are inferred from the claim text.