H05K 2201/0275
Fibers and reinforcement materials
H05K2201/0275 (Fibers and reinforcement materials) appears on 923 US grants and 974 published applications in this corpus.
Search patents in H05K- Granted patents
- 923
- Published applications
- 974
- Assignees
- 526
- Inventors
- 2,269
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 9 | 0 |
| 1977 | 4 | 0 |
| 1978 | 2 | 0 |
| 1979 | 3 | 0 |
| 1980 | 3 | 0 |
| 1981 | 5 | 0 |
| 1982 | 5 | 0 |
| 1983 | 7 | 0 |
| 1984 | 10 | 0 |
| 1985 | 13 | 0 |
| 1986 | 8 | 0 |
| 1987 | 13 | 0 |
| 1988 | 9 | 0 |
| 1989 | 14 | 0 |
| 1990 | 9 | 0 |
| 1991 | 12 | 0 |
| 1992 | 6 | 0 |
| 1993 | 6 | 0 |
| 1994 | 10 | 0 |
| 1995 | 9 | 0 |
| 1996 | 8 | 0 |
| 1997 | 10 | 0 |
| 1998 | 20 | 0 |
| 1999 | 26 | 0 |
| 2000 | 20 | 0 |
| 2001 | 30 | 6 |
| 2002 | 18 | 24 |
| 2003 | 16 | 26 |
| 2004 | 18 | 46 |
| 2005 | 21 | 80 |
| 2006 | 27 | 31 |
| 2007 | 25 | 40 |
| 2008 | 14 | 40 |
| 2009 | 17 | 48 |
| 2010 | 29 | 60 |
| 2011 | 26 | 38 |
| 2012 | 37 | 36 |
| 2013 | 33 | 49 |
| 2014 | 26 | 50 |
| 2015 | 31 | 43 |
| 2016 | 41 | 28 |
| 2017 | 42 | 33 |
| 2018 | 25 | 39 |
| 2019 | 34 | 32 |
| 2020 | 30 | 53 |
| 2021 | 23 | 25 |
| 2022 | 23 | 40 |
| 2023 | 29 | 30 |
| 2024 | 27 | 35 |
| 2025 | 27 | 22 |
| 2026 | 13 | 20 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2201/029Woven fibrous reinforcement or textileIndexing code444
- H05K 2201/0278Polymeric fibersIndexing code224
- H05K 2201/0281Conductive fibersIndexing code201
- H05K 2201/0293Non-woven fibrous reinforcementIndexing code160
- H05K 2201/0284PaperIndexing code88
- H05K 2201/0287Unidirectional or parallel fibersIndexing code49
- H05K 2201/0296Fibers with a special cross-sectionIndexing code10
Recent patents
- Curable compositions29 Sep 2026US 12,747,343 B2AGC Multi Material America, Inc.
- Use of inorganic thin non-woven dielectrics in printed circuit boards8 Sep 2026US 12,733,093 B2Advanced Chip and Circuit Materials, Inc.
- Glass cloth, prepreg, and printed wiring board1 Sep 2026US 12,727,080 B2Asahi Kasei Kabushiki Kaisha
- Use of MgO, ZnO, and rare earth oxides for making improved low dielectric fibers with improved low thermal expansion coefficient for high boron aluminosilicate compositions7 Jul 2026US 12,673,891 B2Electric Glass Fiber America, LLC
- Circuit board unwoven fabric, circuit board prepreg using same and circuit board using same23 Jun 2026US 12,662,775 B2Dupont Safety & Construction, Inc.
- Organic fiber fabric and uses of the same8 Oct 2026US 2026/0308839 A1
- Circuit board and method for manufacturing the same and semiconductor package24 Sep 2026US 2026/0293732 A1LG Innotek Co., Ltd.
- Interconnect substrate and method of making the same27 Aug 2026US 2026/0255478 A1Shinko Electric Industries Co., Ltd.
- Surface-treated glass cloth, prepreg and printed wiring board13 Aug 2026US 2026/0234053 A1Nitto Boseki Co., Ltd.
- Electronic Smoking Device Comprising a Rigidised Flexible PCB9 Jul 2026US 2026/0191260 A1JT International SA
Most cited
By later US patents
- Fabric or garment with integrated flexible information infrastructure445US 6,381,482 B1Georgia Tech Research Corporation · 2002
- Electrically active textiles and articles made therefrom283US 6,210,771 B1Massachusetts Institute of Technology · 2001
- Reinforced plastic laminates for use in the production of printed circuit boards and process for making such laminates and resulting products216US 5,037,691 ACompositech, Inc. · 1991
- Compliant interconnection and method therefor183US 4,642,889 AAMP Incorporated · 1987
- Method of manufacturing a fabric article to include electronic circuitry and an electrically active textile article124US 6,729,025 B2Foster-Miller, Inc. · 2004