H05K 2201/0293
Non-woven fibrous reinforcement
H05K2201/0293 (Non-woven fibrous reinforcement) appears on 160 US grants and 103 published applications in this corpus.
Search patents in H05K- Granted patents
- 160
- Published applications
- 103
- Assignees
- 108
- Inventors
- 411
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 7 | 0 |
| 1977 | 3 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 4 | 0 |
| 1983 | 3 | 0 |
| 1984 | 6 | 0 |
| 1985 | 7 | 0 |
| 1986 | 3 | 0 |
| 1987 | 5 | 0 |
| 1988 | 2 | 0 |
| 1989 | 4 | 0 |
| 1990 | 3 | 0 |
| 1991 | 6 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 6 | 0 |
| 1999 | 7 | 0 |
| 2000 | 9 | 0 |
| 2001 | 9 | 2 |
| 2002 | 5 | 3 |
| 2003 | 5 | 9 |
| 2004 | 3 | 7 |
| 2005 | 5 | 5 |
| 2006 | 1 | 1 |
| 2007 | 1 | 2 |
| 2008 | 1 | 3 |
| 2009 | 2 | 5 |
| 2010 | 0 | 2 |
| 2011 | 2 | 3 |
| 2012 | 1 | 3 |
| 2013 | 2 | 4 |
| 2014 | 2 | 5 |
| 2015 | 3 | 7 |
| 2016 | 3 | 3 |
| 2017 | 4 | 5 |
| 2018 | 4 | 2 |
| 2019 | 3 | 3 |
| 2020 | 0 | 10 |
| 2021 | 3 | 4 |
| 2022 | 4 | 5 |
| 2023 | 2 | 2 |
| 2024 | 3 | 3 |
| 2025 | 2 | 3 |
| 2026 | 2 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Use of inorganic thin non-woven dielectrics in printed circuit boards8 Sep 2026US 12,733,093 B2Advanced Chip and Circuit Materials, Inc.
- Circuit board unwoven fabric, circuit board prepreg using same and circuit board using same23 Jun 2026US 12,662,775 B2Dupont Safety & Construction, Inc.
- Use of inorganic thin non-woven dielectrics in printed circuit boards7 Oct 2025US 12,439,513 B2Advanced Chip and Circuit Materials, Inc.
- Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor package18 Mar 2025US 12,256,490 B2Resonac Corporation
- Fluoride-based resin prepreg and circuit substrate using the same13 Feb 2024US 11,903,127 B2Nan Ya Plastics Corporation
- Band-to-capsule connection techniques and assembly methods for a wrist-wearable device11 Jun 2026US 2026/0164541 A1Meta Platforms Technologies, LLC
- Use of inorganic thin non-woven dielectrics in printed circuit boards5 Feb 2026US 2026/0040443 A1Advanced Chip and Circuit Materials, Inc.
- Non-woven fabric prepreg, metal-foil-clad plate and printed circuit board4 Dec 2025US 2025/0368791 A1Shengyi Technology Co., Ltd.
- Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor package17 Jul 2025US 2025/0234456 A1Resonac Corporation
- Biodegradable composite material16 Jan 2025US 2025/0019505 A1Ctk Research and Development Canada Ltd.
Most cited
By later US patents
- Flame retardant B-staged epoxy resin prepregs and laminates made therefrom67US 4,501,787 AWestinghouse Electric Corp. · 1985
- Adhesive-filler film composite64US 5,879,794 AW. L. Gore & Associates, Inc. · 1999
- High density para-aramid papers62US 4,729,921 AE. I. Du Pont de Nemours and Company · 1988
- High density para-aramid papers60US 4,698,267 AE. I. Du Pont de Nemours and Company · 1987
- Continuous process for producing reinforced resin laminates49US 4,372,800 AKanegafuchi Kagaku Kogyo Kabushiki Kaisha · 1983