Fluoride-based resin prepreg and circuit substrate using the same
AssigneeNan Ya Plastics Corporation
InventorsTe-Chao Liao, Hao-Sheng Chen, Chih-Kai Chang, Hung-Yi Chang
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Abstract
A fluoride-based resin prepreg and a circuit substrate using the same are provided. The fluoride-based resin prepreg includes 100 PHR of a fluoride-based resin and 20 to 110 PHR of an inorganic filler. Based on a total weight of the fluoride-based resin, the fluoride-based resin includes 10 to 80 wt % of polytetrafluoroethylene (PTFE), 10 to 50 wt % of fluorinated ethylene propylene (FEP), and 0.1 to 40 wt % of perfluoroalkoxy alkane (PFA). The circuit substrate includes a fluoride-based resin substrate and a circuit layer that is formed on the fluoride-based resin substrate.
Claims7
A fluoride-based resin prepreg, consisting of:
- a reinforced base layer;
- and
- a fluoride-based resin layer covering the reinforced base layer;
- wherein the fluoride-based resin layer includes 100 PHR of a fluoride-based resin and 20 to 110 PHR of an inorganic filler;
- wherein based on a total weight of the fluoride-based resin, the fluoride-based resin consisting of 10 to 80 wt % of polytetrafluoroethylene (PTFE), 10 to 50 wt % of fluorinated ethylene propylene (FEP), and 0.1 to 40 wt % of perfluoroalkoxy alkane (PFA), and 0.1 to 5 wt % of ethylene-tetra-fluoro-ethylene (ETFE);
- wherein a flowability of the fluoride-based resin prepreg is 4-16% and a pressing temperature of the fluoride-based resin prepreg is 308-375° C.
Dependencies are inferred from the claim text.