Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor package

A prepreg for forming a laminate used in a semiconductor package, the prepreg comprising glass fibers and a thermosetting resin composition, which contains a layer of plural glass fiber filaments aligned to run nearly parallel to each other in one direction,

• wherein the prepreg does not contain a glass fiber bundle of 50 or more glass fiber filaments bundled, or contains such glass fiber bundles, but the content thereof is 10% by volume or less relative to the total amount of the glass fibers in the prepreg, and
• wherein the prepreg has a property that, when a plurality of the prepregs are provided in layers in a laminate that contains a layer of plural glass fiber filaments aligned to run nearly parallel to each other in one direction, and a layer of plural glass fiber filaments aligned to run nearly parallel to each other in the other one direction different from the previous one direction, the laminate has a bending elastic modulus at 25° C. of 35 GPa or more.