Circuit board unwoven fabric, circuit board prepreg using same and circuit board using same
AssigneeDupont Safety & Construction, Inc.
InventorsYuhei Nishimori, Masahiko Ueta
Life of this patent
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Abstract
A circuit board nonwoven fabric comprising a paper-formed structure which comprises a plurality of thick fibers in which the portion of greatest fiber diameter is 5 μm or greater, and a plurality of fine fibers in which the portion of greatest fiber diameter is less than 5 μm, wherein an average fiber length of the thick fibers is greater than an average fiber length of the fine fibers, the number of fine fibers is greater than the number of thick fibers, and the thick fibers have a flat shape with a major axis and a minor axis, the minor axis being oriented in a thickness direction of the paper-formed structure.
Claims6
A circuit board nonwoven fabric comprising a paper-formed structure which comprises a plurality of thick fibers in which the portion of greatest fiber diameter is 5 μm or greater, and a plurality of fine fibers in which the portion of greatest fiber diameter is less than 5 μm,
- characterized in that an average fiber length of the thick fibers is greater than an average fiber length of the fine fibers,
- the number of fine fibers is greater than the number of thick fibers, and
- the thick fibers have a flat shape with a major axis and a minor axis,
- the minor axis being oriented in a thickness direction of the paper-formed structure,
- wherein the fiber diameter of the minor axis of the thick fibers is 10 μm or less, and
- wherein the fiber diameter of the major axis of the thick fibers is 5 μm-20 μm.
Dependencies are inferred from the claim text.