Adhesive-filler film composite
AssigneeW. L. Gore & Associates, Inc.
InventorJoseph E. Korleski, Jr.
Life of this patent
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AssigneeW. L. Gore & Associates, Inc.
InventorJoseph E. Korleski, Jr.
Estimating the term…
A method of preparing an adhesive composite is provided where a fluoropolymer having nodes and interconnected fibrils with a void volume formed from the node and interconnected fibril structure is at least partially filled with a paste formed from a thermoset or thermoplastic adhesive and a particulate vapor phase formed inorganic filler having uniform surface curvature, sufficient adhesive and filler are present to provide a composite having between about 5 to about 40 volume percent polymeric substrate, 10-95 volume percent adhesive and filler imbibed within the voids of said substrate and 5 to 85 volume percent inorganic filler is contained within the composite. In the composite, the ratio of mean flow pore size to largest particle size is at least above 0.7; or the ratio of mean flow pore size to average particle size is greater than 1.5; or the ratio of minimum pore size to average particle size is at least above 0.8; or the ratio of minimum pore size to largest particle size is at least above 0.4.
A composite adhesive material comprising:
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A multilayer circuit device comprising:
Dependencies are inferred from the claim text.