H05K 2201/0278
Polymeric fibers
H05K2201/0278 (Polymeric fibers) appears on 224 US grants and 161 published applications in this corpus.
Search patents in H05K- Granted patents
- 224
- Published applications
- 161
- Assignees
- 146
- Inventors
- 483
- Latest grant
- 12 Aug 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 5 | 0 |
| 1986 | 2 | 0 |
| 1987 | 7 | 0 |
| 1988 | 5 | 0 |
| 1989 | 9 | 0 |
| 1990 | 7 | 0 |
| 1991 | 4 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 3 | 0 |
| 1995 | 4 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 6 | 0 |
| 1999 | 15 | 0 |
| 2000 | 8 | 0 |
| 2001 | 13 | 5 |
| 2002 | 8 | 7 |
| 2003 | 4 | 13 |
| 2004 | 9 | 9 |
| 2005 | 8 | 15 |
| 2006 | 4 | 10 |
| 2007 | 5 | 11 |
| 2008 | 6 | 12 |
| 2009 | 5 | 12 |
| 2010 | 8 | 9 |
| 2011 | 5 | 2 |
| 2012 | 8 | 8 |
| 2013 | 5 | 3 |
| 2014 | 2 | 3 |
| 2015 | 2 | 4 |
| 2016 | 1 | 3 |
| 2017 | 2 | 1 |
| 2018 | 1 | 6 |
| 2019 | 6 | 3 |
| 2020 | 2 | 6 |
| 2021 | 1 | 2 |
| 2022 | 5 | 3 |
| 2023 | 5 | 4 |
| 2024 | 1 | 5 |
| 2025 | 3 | 4 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board12 Aug 2025US 12,384,916 B2Mitsubishi Gas Chemical Company, Inc.
- UV curable dielectric materials for 3D printing and 3D printing systems with the same27 May 2025US 12,317,427 B2Toyota Motor Engineering & Manufacturing North America, Inc.
- Terminally modified polybutadiene, resin composition for metal-clad laminates, prepreg, and metal-clad laminate14 Jan 2025US 12,195,567 B2Nippon Soda Co., Ltd.
- Electro-optical device comprising a plurality of terminals having a plurality of recessed portions including first and second recessed portions and electronic apparatus24 Sep 2024US 12,099,277 B2Seiko Epson Corporation
- Elastic printed conductors19 Dec 2023US 11,849,540 B2The Governors of the University of Alberta
- Organic fiber fabric and uses of the same8 Oct 2026US 2026/0308839 A1
- Method for producing varnish-like cyclic olefin copolymer composition, cyclic olefin copolymer composition, crosslinked product, film, or sheet, laminate, circuit board, electronic device, and prepreg25 Dec 2025US 2025/0388767 A1Mitsui Chemicals, Inc.
- Non-woven fabric prepreg, metal-foil-clad plate and printed circuit board4 Dec 2025US 2025/0368791 A1Shengyi Technology Co., Ltd.
- Laminated substrate and method of manufacturing laminated substrate4 Dec 2025US 2025/0374420 A1Fict Limited
- Material sheet having lcp fibers and low-loss dielectric21 Aug 2025US 2025/0267789 A1LCP Medical Technologies, Inc.
Most cited
By later US patents
- Reinforced plastic laminates for use in the production of printed circuit boards and process for making such laminates and resulting products216US 5,037,691 ACompositech, Inc. · 1991
- Plural layer woven electronic textile, article and method111US 7,144,830 B2Sarnoff Corporation · 2006
- High density printed wiring board possessing controlled coefficient of thermal expansion with thin film redistribution layer105US 6,323,436 B1International Business Machines Corporation · 2001
- Flexible printed circuits100US 5,121,297 ACompaq Computer Corporation · 1992
- Two-sided printed circuit board a multi-layered printed circuit board85US 5,440,075 AMatsushita Electric Industrial Co., Ltd. · 1995