Loading patent…
AssigneeCompositech, Inc.
InventorsJonas Medney, Fred E. Klimpl
Estimating the term…
A warp-free laminate is produced by winding a first set of strands or filaments about a flat mandrel with a second set of strands being wound transverse to the first set. The two sets may be perpendicular to each other. The filaments are maintained under a controlled tension while being impregnated with a resin and during subsequent cure of the resin. In order to permit the formation of a warp-free product, the winding pattern is such that it forms a mirror image about a neutral axis or plane of symmetry. The winding pattern may be chosen to provide interstices in a predetermined pattern permitting punching out or high speed drilling of hole openings for subsequent printed circuit applications.
A printed circuit board comprising a matrix having first and second exterior sides and a plane of symmetry parallel thereto and within said matrix, a plurality of layers, each layer comprising a plurality of filament sections arranged generally in the same direction, said filament sections being arranged in mirror image relationship relative to said plane of symmetry, said exterior sides having a flatness and surface finish suitable for use as a printed circuit board.
A multilayer printed circuit board comprising a continuous, essentially void-free resin matrix having outer surfaces, conductive metal on at least one side of said outer surfaces, and interior printed circuit boards in spaced relation and encapsulated by said resin matrix.
A printed circuit board comprising a matrix having first and second outer surfaces and a plurality of filament sections embedded therein and in parallel layers arranged in mirror image relationship relative to a plane of symmetry parallel to said outer surfaces, wherein filament sections within each respective layer are arranged generally in the same direction, and the filament sections in one layer are arranged at an angle with respect to each adjacent layer.
A printed circuit board comprising a matrix having embedded therein a plurality of filament sections arranged in parallel layers arranged in mirror image relative to a plane of symmetry, the filament sections in each respective layer being parallel, the filament sections in alternate layers being arranged angularly with respect to each adjacent layer, wherein the filament sections are maintained during the setting or curing of the matrix at a tension which is the minimum necessary to maintain alignment of the filament sections, such that the resultant structure is substantially free from warpage.
A printed circuit board comprising a matrix having X and Y directions which are perpendicular to each other and layers of continuous filaments in said matrix, said matrix and filaments being so constructed and arranged as to provide a plane of symmetry therein and thermal coefficients of expansion which are essentially the same in the X and Y directions.
A printed circuit board comprising a matrix having X and Y directions and layers of continuous filaments in said matrix, said matrix and filaments being so constructed and arranged as to provide thermal coefficients of expansion which are the same in the X and Y directions, wherein the filaments are so constructed and arranged as to provide section modulus of elasticity values which are tailored in the X and Y directions.
A multilayer printed circuit board comprising a continuous matrix having outer surfaces suitable for supporting a metal printed circuit thereupon;
Dependencies are inferred from the claim text.