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US 12,384,916 B2Granted
Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsTakashi Kobayashi, Kazuhiro Hashiguchi, Keiichi Hasebe
Life of this patent
Estimating the term…
Abstract
Provided is a resin composition having excellent low water absorption, as well as a cured product, a prepreg, a metal foil-clad laminate, a resin sheet, and a printed wiring board. The resin composition contains a compound (A) represented by Formula (M1) and a compound (B) containing two or more unsaturated carbon-carbon double bonds, and in Formula (M1), A is a four- to six-membered alicyclic group:
Claims21
A resin composition comprising:
- a compound (A) represented by Formula (M1) and compound (B), that is a poly (phenylene ether) compound containing two or more unsaturated carbon-carbon double bonds:
- wherein Formula (M1), RM1, RM2, RM3, and RM4 each independently represent a hydrogen atom or an organic group;
- RM5 and RM6 each independently represent a hydrogen atom or an alkyl group;
- ArM represents a divalent aromatic group;
- A is a four- to six-membered alicyclic group;
- RM7 and RM8 are each independently an alkyl group;
- mx is 1 or 2;
- lx is 0 or 1;
- RM9 and RM10 each independently represent a hydrogen atom or an alkyl group;
- RM11, RM12, RM13, and RM14 each independently represent a hydrogen atom or an organic group;
- and nx represents an integer of 1 or greater and 20 or less.
8 more elements
Dependencies are inferred from the claim text.