US 12,317,427 B2 · UV curable dielectric materials for 3D printing and 3D printing systems with the same

Abstract

A 3D printing system includes a reservoir for a UV-curable dielectric material in communication with a first nozzle configured to print the UV-curable dielectric material onto a substrate and a reservoir for a low CTE filler in communication with a second nozzle configured to print the low CTE filler onto the substrate, and a reservoir for a conductive ink in communication with a third nozzle configured to print the conductive ink onto the substrate. The 3D printing system prints the UV-curable dielectric material and the low CTE filler such that the printed low CTE filler mixes with the printed UV-curable dielectric material and forms a UV-curable dielectric layer with the low CTE filler dispersed therein.

Claims20

Dependent claims

A method comprising:

3D printing a first ink comprising UV-curable dielectric material mixed with a low CTE filler from a first nozzle onto a substrate and forming a UV-curable dielectric layer with a predefined content of the low CTE filler dispersed therein;
3D printing a second ink comprising a conductive material from a second nozzle different than the first nozzle and forming a conductive layer on the substrate;
UV curing the UV-curable dielectric layer with the low CTE filler dispersed therein and forming a CTE-tuned dielectric layer on the substrate;
and
thermally curing the conductive layer on the substrate such that a layer of a multi-layer printed circuit board (PCB) is formed.

2 more elements

Dependencies are inferred from the claim text.

UV curable dielectric materials for 3D printing and 3D printing systems with the same

Life of this patent

UV curable dielectric materials for 3D printing and 3D printing systems with the same

Life of this patent

Abstract

Claims20