H05K 2201/0284
Paper
Official title: Paper, e.g. as reinforcement
H05K2201/0284 (Paper) appears on 88 US grants and 57 published applications in this corpus.
Search patents in H05K- Granted patents
- 88
- Published applications
- 57
- Assignees
- 89
- Inventors
- 238
- Latest grant
- 23 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 4 | 0 |
| 1983 | 3 | 0 |
| 1984 | 6 | 0 |
| 1985 | 5 | 0 |
| 1986 | 3 | 0 |
| 1987 | 3 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 4 | 1 |
| 2002 | 2 | 3 |
| 2003 | 3 | 4 |
| 2004 | 1 | 3 |
| 2005 | 3 | 2 |
| 2006 | 2 | 3 |
| 2007 | 1 | 1 |
| 2008 | 0 | 2 |
| 2009 | 1 | 4 |
| 2010 | 1 | 4 |
| 2011 | 2 | 4 |
| 2012 | 0 | 4 |
| 2013 | 1 | 1 |
| 2014 | 2 | 0 |
| 2015 | 3 | 2 |
| 2016 | 0 | 0 |
| 2017 | 1 | 2 |
| 2018 | 0 | 2 |
| 2019 | 2 | 4 |
| 2020 | 1 | 5 |
| 2021 | 2 | 0 |
| 2022 | 1 | 0 |
| 2023 | 1 | 3 |
| 2024 | 0 | 2 |
| 2025 | 1 | 1 |
| 2026 | 2 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board unwoven fabric, circuit board prepreg using same and circuit board using same23 Jun 2026US 12,662,775 B2Dupont Safety & Construction, Inc.
- Prepreg, and metal-clad laminated board and wiring substrate obtained using same17 Mar 2026US 12,581,593 B2Panasonic Intellectual Property Management Co., Ltd.
- Terminally modified polybutadiene, resin composition for metal-clad laminates, prepreg, and metal-clad laminate14 Jan 2025US 12,195,567 B2Nippon Soda Co., Ltd.
- Circuit board for non-combustion type flavor inhaler and non-combustion type flavor inhaler4 Jul 2023US 11,690,402 B2Japan Tobacco Inc.
- Monitoring circuitry1 Feb 2022US 11,240,913 B2HP Indigo B. V.
- Alternative for fr-4 material22 May 2025US 2025/0168976 A1PaperShell AB
- Method for contacting an electrically conductive paper structure, composite body and use31 Oct 2024US 2024/0365441 A1Giesecke+Devrient Currency Technology GmbH
- Circuit board unwoven fabric, circuit board prepreg using same and circuit board using same18 Apr 2024US 2024/0125050 A1Dupont Safety & Construction, Inc.
- Process for manufacturing an electrically conducting device from lignocellulosic material4 May 2023US 2023/0140418 A1SAS Woodoo
- Permeable element16 Mar 2023US 2023/0085480 A1Kompetenzzentrum Holz GmbH
Most cited
By later US patents
- Z-axis compressible polymer with fine metal matrix suspension78US 6,270,363 B1International Business Machines Corporation · 2001
- Flame retardant B-staged epoxy resin prepregs and laminates made therefrom67US 4,501,787 AWestinghouse Electric Corp. · 1985
- Continuous process for producing reinforced resin laminates49US 4,372,800 AKanegafuchi Kagaku Kogyo Kabushiki Kaisha · 1983
- Method for producing a contactless chip card using transfer paper37US 6,908,786 B2Ask S.A. · 2005
- Coated fabrics and laminated articles therefrom33US 4,020,209 AE. I. Du Pont de Nemours and Company · 1977