Circuit board and method for manufacturing the same and semiconductor package

Abstract

The present embodiment relates to a circuit board and semiconductor package. The circuit board according to one aspect of the present invention comprises: an insulating layer including resin and glass fibers disposed within the resin; and a circuit portion disposed on the insulating layer, wherein the glass fibers include first glass fibers extending in a first horizontal direction and second glass fibers disposed on the first glass fibers and extending in a second horizontal direction, wherein the cross-section of the first glass fibers and the cross-section of the second glass fibers are disposed on the cross-section of said circuit portion, wherein the first glass fiber includes a plurality of regions disposed such that its thickness in the vertical direction varies along a third horizontal direction forming a predetermined angle with the first horizontal direction, and the second glass fiber includes a plurality of cross-section portions disposed spaced apart along the third horizontal direction.

Dependencies are inferred from the claim text.