H05K 2201/0296
Fibers with a special cross-section
Official title: Fibers with a special cross-section, e.g. elliptical
H05K2201/0296 (Fibers with a special cross-section) appears on 10 US grants and 7 published applications in this corpus.
Search patents in H05K- Granted patents
- 10
- Published applications
- 7
- Assignees
- 10
- Inventors
- 40
- Latest grant
- 2 Mar 2021
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 2 | 1 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 2 |
| 2011 | 1 | 0 |
| 2012 | 0 | 0 |
| 2013 | 1 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 1 |
| 2016 | 1 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 1 |
| 2021 | 1 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Glass cloth, prepreg, and glass fiber reinforced resin molded product2 Mar 2021US 10,934,640 B2Nitto Boseki Co., Ltd.
- Wiring substrate and semiconductor device9 Feb 2016US 9,257,386 B2Shinko Electric Industries Co., Ltd.
- Multilayer-wired substrate19 Feb 2013US 8,377,543 B2NEC Corporation
- Fiber-reinforced resin and method for manufacturing the same6 Sep 2011US 8,012,561 B2KYOCERA Corporation
- Glass fiber nonwoven fabric and printed wiring board9 Sep 2003US 6,615,616 B2Nitto Boseki Co., Ltd.
- Continuous silica fiber reinforced composites for high-frequency printed circuit board and methods of making30 May 2024US 2024/0179837 A1Corning Incorporated
- Glass cloth, prepreg, and glass fiber reinforced resin molded product5 Mar 2020US 2020/0071858 A1Nitto Boseki Co., Ltd.
- Wiring Substrate and Semiconductor Device25 Jun 2015US 2015/0179560 A1Shinko Electric Industries Co., Ltd.
- Fiber-Reinforced Resin and Method for Manufacturing the Same3 Jun 2010US 2010/0136284 A1KYOCERA Corporation
- Multilayer-wired substrate4 Mar 2010US 2010/0051327 A1NEC Corporation
Most cited
By later US patents
- High density printed circuit substrate and method of fabrication27US 6,242,078 B1Isola Laminate Systems Corp. · 2001
- Printed circuit board fabrication24US 4,980,217 A1990
- Glass cloth for printed circuits and method of manufacture wherein yarns have a substantially elliptical cross-section17US 4,579,772 AInternational Business Machines Corporation · 1986
- Glass fiber nonwoven fabric and printed wiring board5US 6,543,258 B1Nitto Boseki Co., Ltd. · 2003
- Wiring substrate and semiconductor device4US 9,257,386 B2Shinko Electric Industries Co., Ltd. · 2016