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US 8,377,543 B2Granted
Multilayer-wired substrate
AssigneeNEC Corporation
InventorToshinobu Ogatsu
Life of this patent
Estimating the term…
Abstract
Provided is a multilayer-wired substrate for mobile electric equipment, wherein the multilayer-wired substrate is very strong, includes a larger elastically deformable region and a higher elasticity than those of the conventional structure, and can be curved. The multilayer-wired substrate is a multilayer-wired substrate including one or more insulating layers. At least one insulating layer of the substrate is made of a material in which the mechanical characteristic in an in-plane direction component exhibits anisotropy.
Claims5
A multilayer-wired substrate comprising three or more insulating layers,
- wherein a core insulating layer in the substrate is includes an unidirectionally fiber-reinforced resin material whose fiber is arranged parallel to a bending direction of the substrate, insulating layers that are on upper and lower sides of the core insulating layer in the substrate are made of the unidirectionally fiber-reinforced resin material whose fiber is arranged along a bending direction of the substrate, and further an insulating layer directly under a conductive layer of a top layer, which is different from insulating layers that are on the upper and lower sides of said core insulating layer, is made of the unidirectionally fiber-reinforced resin material whose fiber is arranged in a direction perpendicular to the bending direction of the substrate.
Dependencies are inferred from the claim text.