High density printed circuit substrate and method of fabrication
AssigneeIsola Laminate Systems Corp.
InventorsRichard J. Pommer, Jeffrey T. Gotro, Nancy M. W. Androff, Marc D. Hein, Corey J. Zarecki
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Abstract
The present invention is a method and apparatus for providing an electrical substrate. The electrical substrate comprises a dielectric layer having a surface roughness of no greater than 6.0 microns. A first conductive layer is attached to the dielectric layer. In one embodiment, the dielectric layer comprises a laminate that comprises a cloth having a uniform weave and a resin that is consistently impregnated within the uniform weave. A removable layer may be attached to the laminate and removed prior to metallizing of the first conductive layer. Various embodiments are described.
Claims19
An electrical substrate comprising:
- a dielectric layer having a surface roughness of no greater than 6.0 microns;
- and
- a first conductive layer attached to said dielectric layer wherein the conductive layer is applied to at least a portion of the dielectric layer surface that has a roughness of no greater than 6.0 microns.
An integrated circuit package, comprising:
- a substrate comprising:
- a dielectric layer having a surface roughness no more than 6.0 microns;
- and
- a first conductive layer attached to said dielectric layer;
- and an integrated circuit that is attached to said substrate wherein the conductive layer is applied to at least a portion of the dielectric layer surface that has a roughness of no greater than 6.0 microns.
Dependencies are inferred from the claim text.