Method of manufacturing a fabric article to include electronic circuitry and an electrically active textile article
AssigneeFoster-Miller, Inc.
InventorsBrian Farrell, Patricia Wilson Nguyen, Justyna Teverovsky, Jeremiah Slade, Mara Powell
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Abstract
A method of manufacturing a fabric article to include electronic circuitry in which a flex circuit is assembled to include conductive traces and pads on a flexible substrate, a fabric article is placed on a rigid surface, and the substrate of the flex circuit is secured to the fabric article. Also disclosed is a fabric article which includes electronic circuitry and an electrically active textile article.
Claims44
A method of manufacturing a fabric article to include electronic circuitry, the method comprising:
- assembling a circuit to include traces and pads on a substrate;
- placing a fabric article on a surface;
- and
- securing the substrate of the circuit to the fabric article.
A method of manufacturing a fabric article to include electronic circuitry, the method comprising:
- assembling a flex circuit to include conductive traces and pads on a flexible substrate;
- placing a fabric article on a surface;
- securing the substrate of the flex circuit to the fabric article;
- populating the flex circuit with electronic components;
- and
- securing a protective covering over the flex circuit and the electronic components.
A method of manufacturing a clothing article to include electronic circuitry, the method comprising:
- assembling a flex circuit to include conductive traces and pads on a flexible substrate;
- placing an article of clothing on a surface;
- securing the substrate of the flex circuit to the article of clothing;
- populating the flex circuit with electronic components;
- and
- securing a protective covering over the flex circuit and the electronic components.
A method of manufacturing a clothing article with at least upper and lower layers of fabric material to include electronic circuitry, the method comprising:
- assembling a flexible circuit to include traces and pads on a substrate;
- placing a rigid support surface between the layers of fabric material, the rigid support surface comprising a stainless steel plate;
- and
- securing the substrate to the upper fabric layer of the clothing article using a hand held ultrasonic horn to bond the substrate to the upper layer of the clothing article.
A method of manufacturing a fabric article to include electronic circuitry, the method comprising:
- assembling a flexible circuit to include traces and pads on a substrate;
- placing the substrate between the fabric article and a covering;
- and
- securing the covering to the fabric article such that the flexible circuit is in pressing engagement with the fabric article and the covering.
A method of manufacturing a fabric article to include electronic circuitry, the method comprising:
- assembling a flexible circuit to include traces and pads on a substrate;
- forming a pocket on the fabric article by securing a covering to the fabric article such that at least one edge of the covering is unattached to the fabric article;
- placing the substrate into the pocket;
- and
- bonding the at least one edge of the covering to the fabric article such that the flexible circuit is in pressing engagement with the fabric article and the covering.
Dependencies are inferred from the claim text.