H05K 2201/029
Woven fibrous reinforcement or textile
H05K2201/029 (Woven fibrous reinforcement or textile) appears on 444 US grants and 538 published applications in this corpus.
Search patents in H05K- Granted patents
- 444
- Published applications
- 538
- Assignees
- 273
- Inventors
- 1,207
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 3 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 4 | 0 |
| 1995 | 4 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 11 | 0 |
| 1999 | 9 | 0 |
| 2000 | 7 | 0 |
| 2001 | 11 | 0 |
| 2002 | 9 | 14 |
| 2003 | 7 | 11 |
| 2004 | 8 | 18 |
| 2005 | 7 | 17 |
| 2006 | 14 | 18 |
| 2007 | 7 | 26 |
| 2008 | 5 | 23 |
| 2009 | 10 | 17 |
| 2010 | 15 | 37 |
| 2011 | 18 | 27 |
| 2012 | 23 | 23 |
| 2013 | 25 | 39 |
| 2014 | 20 | 33 |
| 2015 | 13 | 27 |
| 2016 | 30 | 18 |
| 2017 | 25 | 21 |
| 2018 | 14 | 24 |
| 2019 | 18 | 17 |
| 2020 | 18 | 25 |
| 2021 | 11 | 11 |
| 2022 | 12 | 29 |
| 2023 | 16 | 16 |
| 2024 | 16 | 22 |
| 2025 | 17 | 15 |
| 2026 | 5 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Curable compositions29 Sep 2026US 12,747,343 B2AGC Multi Material America, Inc.
- Glass cloth, prepreg, and printed wiring board1 Sep 2026US 12,727,080 B2Asahi Kasei Kabushiki Kaisha
- Fluoroplastic substrate for high-speed communications and copper-clad fluoroplastic substrate for high-speed communications3 Feb 2026US 12,540,222 B2Shin-Etsu Chemical Co., Ltd.
- Plate-shaped composite material20 Jan 2026US 12,528,922 B2Nitto Denko Corporation
- Metal organic frameworks (MOFS) filler for enabling low CTE and low dielectric constant PCB20 Jan 2026US 12,532,412 B2Intel Corporation
- Circuit board and method for manufacturing the same and semiconductor package24 Sep 2026US 2026/0293732 A1LG Innotek Co., Ltd.
- Surface-treated glass cloth, prepreg and printed wiring board13 Aug 2026US 2026/0234053 A1Nitto Boseki Co., Ltd.
- Integrated system for textile hybrid electronics via laser hybrid manufacturing9 Jul 2026US 2026/0197947 A1Zhejiang University
- Substrate, printed wiring board, and semiconductor package2 Jul 2026US 2026/0191049 A1Resonac Corporation
- Printed circuit board7 May 2026US 2026/0129751 A1Sumitomo Electric Printed Circuits, Inc.
Most cited
By later US patents
- Fabric or garment with integrated flexible information infrastructure445US 6,381,482 B1Georgia Tech Research Corporation · 2002
- Electrically active textiles and articles made therefrom283US 6,210,771 B1Massachusetts Institute of Technology · 2001
- Method of manufacturing a fabric article to include electronic circuitry and an electrically active textile article124US 6,729,025 B2Foster-Miller, Inc. · 2004
- Plural layer woven electronic textile, article and method111US 7,144,830 B2Sarnoff Corporation · 2006
- Fabric and yarn structures for improving signal integrity in fabric-based electrical circuits96US 7,348,285 B2North Carolina State University · 2008