Integrated system for textile hybrid electronics via laser hybrid manufacturing

An integrated system for textile hybrid electronics via laser hybrid manufacturing, comprising a textile substrate, conductive textile traces and physiological electrodes, vertical interconnect accesses (VIAs), laser-induced flexible sensors, and surface mounted devices (SMDs), wherein the textile substrate is made of one or more materials selected from the group consisting of:

• modal knitted fabric, medical non-woven fabric, polyimide (PI) fabric, and taffeta woven fabric;
• all electronic components are densely integrated on a single textile substrate and distributed on surfaces of two sides of the textile substrate, interconnected to achieve complete circuit functionality;
• and a preparation process specifically comprises the steps of:
• S1, formation of the laser-induced flexible sensors:
• modifying the textile substrate or precursor materials on a surface of the textile substrate using a laser according to a pre-designed pattern, to generate the laser-induced flexible sensors on one side of the textile substrate for detecting physical and chemical signals on a human body surface;
• and electrically routing the laser-induced flexible sensors out from the other side of the textile substrate;
• S2, formation of the VIAs:
• employing a pneumatic method to infiltrate conductive paste into textured structures of the textile substrate at locations on the textile substrate where VIAs are required to connect circuits on two sides of the textile substrate, to achieve electrical connectivity between front and back faces at corresponding regions of the textile substrate, with the conductive paste being an intermetallic compound formed from a liquid metal (LM)/copper nanoparticle (Cu NP) mixture, which is prepared using a centrifugal mixer;
• S3, formation of the conductive textile traces and physiological electrodes:
• cutting a conductive textile using a laser according to a pre-designed pattern to form the conductive traces and physiological electrodes;
• and transferring the conductive traces and electrodes onto the two sides of the textile substrate using a transfer-printing process, causing the conductive traces and electrodes on the two sides to be electrically interconnected through the VIAs;
• and
• S4, integration of the SMDs:
• soldering the SMDs onto the conductive textile traces using a low-melting solder paste, forming a complete circuit.