Glass cloth, prepreg, and printed wiring board

Abstract

The present disclosure relates to a glass cloth, prepreg, and printed circuit board. There is provided a glass cloth including woven glass yarns each containing a plurality of filaments, wherein a bulk dissipation factor of a glass in the glass yarns is 0.0010 or less, a tensile strength of warp yarns per thickness of the glass cloth as represented by the following formula (A) is in the range of 0.50 to 6.0: warp direction tensile strength (N/25 mm) of the glass cloth/thickness of the glass cloth (μm)  (A), a coefficient of variation of the warp direction tensile strength of the glass cloth is in the range of 15% or less, and a dissipation factor of the glass cloth at 10 GHz is in the range of greater than 0 and 0.0010 or less.

Dependencies are inferred from the claim text.