H05K 2201/0287
Unidirectional or parallel fibers
H05K2201/0287 (Unidirectional or parallel fibers) appears on 49 US grants and 25 published applications in this corpus.
Search patents in H05K- Granted patents
- 49
- Published applications
- 25
- Assignees
- 34
- Inventors
- 86
- Latest grant
- 18 Mar 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 3 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 3 |
| 2003 | 1 | 2 |
| 2004 | 2 | 1 |
| 2005 | 1 | 2 |
| 2006 | 2 | 0 |
| 2007 | 0 | 2 |
| 2008 | 0 | 0 |
| 2009 | 1 | 0 |
| 2010 | 1 | 4 |
| 2011 | 1 | 0 |
| 2012 | 2 | 1 |
| 2013 | 1 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 2 |
| 2016 | 2 | 0 |
| 2017 | 5 | 1 |
| 2018 | 3 | 0 |
| 2019 | 0 | 2 |
| 2020 | 2 | 4 |
| 2021 | 0 | 0 |
| 2022 | 2 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 0 |
| 2025 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor package18 Mar 2025US 12,256,490 B2Resonac Corporation
- Integrally formed product, and composite material, terminal for electrical contact and printed wiring board including the integrally formed product14 Jun 2022US 11,361,876 B2Furukawa Electric Co., Ltd.
- Printed circuit board trace for galvanic effect reduction25 Jan 2022US 11,234,327 B1Western Digital Technologies, Inc.
- Thick conductor built-in type printed wiring board and method for producing same29 Sep 2020US 10,791,633 B2Panasonic Intellectual Property Management Co., Ltd.
- Circuit board and semiconductor package using the same7 Apr 2020US 10,616,998 B2Samsung Electronics Co., Ltd.
- Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor package17 Jul 2025US 2025/0234456 A1Resonac Corporation
- Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor package24 Dec 2020US 2020/0404783 A1Hitachi Chemical Company, Ltd.
- Circuit board and semiconductor package using the same23 Jul 2020US 2020/0236778 A1Samsung Electronics Co., Ltd.
- Thick conductor built-in type printed wiring board and method for producing same26 Mar 2020US 2020/0100370 A1Panasonic Intellectual Property Management Co., Ltd.
- Integrally formed product, and composite material, terminal for electrical contact and printed wiring board including the integrally formed product6 Feb 2020US 2020/0043627 A1Furukawa Electric Co., Ltd.
Most cited
By later US patents
- Reinforced plastic laminates for use in the production of printed circuit boards and process for making such laminates and resulting products216US 5,037,691 ACompositech, Inc. · 1991
- High-frequency multilayer printed circuit board86US 4,812,792 ATRW Inc. · 1989
- Method for making reinforced plastic laminates for use in the production of circuit boards53US 4,943,334 ACompositech, Inc. · 1990
- Continuous process for the manufacture of substrates for printed wire boards37US 5,269,863 AAkzo N. V. · 1993
- Methods for making multilayer printed circuit boards34US 5,376,326 ACompositech, Inc. · 1994