Circuit board and semiconductor package using the same

A circuit board comprising:

• at least one first prepreg including a first fiber layer, the first fiber layer being woven with a plurality of first fibers arranged in a first direction and a plurality of second fibers arranged in a second direction that is substantially perpendicular to the first direction;
• at least one second prepreg including a second fiber layer, the second fiber layer being woven with a plurality of third fibers arranged in the first direction and a plurality of fourth fibers arranged in the second direction;
• a circuit layer on at least one of opposite surfaces of the at least one first prepreg or the at least one second prepreg,
• wherein the at least one first prepreg and the at least one second prepreg each have a length in the first direction greater than a length in the second direction, each of the plurality of first fibers comprises a filling yarn, each of the plurality of second fibers comprises a warp yarn, each of the plurality of third fibers comprises a warp yarn, and each of the plurality of fourth fibers comprises a filling yarn,
• wherein the plurality of first fibers and the plurality of second fibers are woven to have a plurality of intersection regions arranged in a matrix, and each of the plurality of intersection regions has a size in the first direction that is smaller than a size in the second direction.

A semiconductor package comprising:

• at least one semiconductor chip;
• a package substrate having a first surface and an opposite second surface, the first surface having a first region in which the at least one semiconductor chip is mounted and a second region different from the first region;
• and
• a molding encapsulating the at least one semiconductor chip on the first surface of the package substrate,
• wherein the package substrate includes:
• at least one prepreg including a fiber layer, the fiber layer being woven with a plurality of first fibers arranged in a first direction and a plurality of second fibers arranged in a second direction that is substantially perpendicular to the first direction;
• and
• a circuit layer disposed on at least one of opposite surfaces of the at least one prepreg,
• wherein the at least one prepreg has a length in the first direction greater than a length in the second direction, each of the plurality of first fibers comprises a filling yarn, each of the plurality of second fibers comprises a warp yarn, and the first region has a shape that is longer in the first direction than in the second direction,
• wherein the at least one prepreg comprises a plurality of prepregs.