Methods for making multilayer printed circuit boards
AssigneeCompositech, Inc.
InventorsJonas Medney, Fred E. Klimpl
Life of this patent
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Abstract
A method for making a multilayered printed circuit board including the steps of arranging two plates in spaced relation, arranging a perimetral seal between the two plates with an upper opening in the seal to form an upwardly open chamber, placing a plurality of printed circuit boards between the plates in spaced relation to one another, placing the chamber under vacuum, injecting a settable matrix material into the chamber, compressing the end plates towards one another to achieve the desired outer dimensions of the board, and curing the settable matrix material.
Claims31
A method of making a multilayer printed circuit board comprising arranging two end plates in spaced relation, arranging a perimetral seal between the plates with an upper opening in the seal to form an upwardly open chamber, arranging a plurality of printed circuit boards, each having a printed metal circuit thereon, between the plates in spaced relation to one another, inserting a spreader through said opening to spread the boards, injecting a settable material into said chamber between the spread boards, removing said spreader from between the boards and curing the settable material to set the same, thus forming a multilayer printed circuit board.
A method for making a multilayer printed circuit board which comprises:
- assembling a plurality of printed circuit boards in spaced relation to form an assembly;
- placing the assembly of printed circuit boards into a vessel comprising two outer plates which are essentially parallel and a U-shaped gasket on three marginal side portions therebetween;
- placing the assembly and vessel into a vacuum chamber and evacuating same;
- injecting a settable resin into the vessel to fill it to the desired level corresponding to the volume of the multilayer circuit board;
- and
- curing the resin to form the multilayer printed circuit board.
A method of making a multilayer printed circuit board comprising arranging two plates in spaced relation, arranging a perimetral seal between the plates with an upper opening in the seal to form an upwardly open chamber, placing a plurality of printed circuit boards between the plates in spaced relation to one another, injecting a settable matrix material into the chamber and around the structures, compressing the end plates towards each other to achieve the desired outer dimensions of the board, and curing the settable matrix material to set the same.
Dependencies are inferred from the claim text.