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US 2026/0255478 A1Published application
Interconnect substrate and method of making the same
AssigneeShinko Electric Industries Co., Ltd.
InventorsRisa KARASAWA, Junji SATO, Nobutaka AOKI
Life of this patent
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Abstract
An interconnect substrate includes a core layer containing fiber bundles including a plurality of fibers, a cavity extending through the core layer, an electronic component disposed in the cavity, and an insulating layer covering the electronic component in the cavity, wherein the fibers protrude from an inner wall surface of the cavity, and the insulating layer is introduced into spaces between the fibers in the cavity.
Claims13
An interconnect substrate comprising:
- a core layer containing fiber bundles including a plurality of fibers;
- a cavity extending through the core layer;
- an electronic component disposed in the cavity;
- and
- an insulating layer covering the electronic component in the cavity,
- wherein the fibers protrude from an inner wall surface of the cavity, and
- the insulating layer is introduced into spaces between the fibers in the cavity.
4 more elements
Dependencies are inferred from the claim text.