Organic substrate for placing components of a camera

A device, comprising:

• a camera that comprises:
• one or more lenses;
• an organic substrate formed as one single piece of an organic circuit board or multiple separate organic circuit boards joined together;
• an image sensor attached to the organic substrate and in contact with an image side surface of the organic substrate to communicate electrical signals over conductive traces routed at multiple layers of the organic circuit board or the multiple separate organic circuit boards and to generate image signals based on light passing through the one or more lenses along an optical axis;
• and
• an infrared (IR) light filter attached to the organic substrate at a second side opposite the image side surface, such that the IR light filter is positioned optically between the one or more lenses and the image sensor;
• and
• a processor configured to process the image signals generated from the image sensor of the camera to produce one or more images,
• wherein the organic substrate of the camera includes an opening between the IR light filter and the image sensor to allow the light passing through the IR light filter to reach the image sensor through the opening.

A system, comprising:

• one or more lenses;
• an organic printed circuit board (PCB) movable relative to the one or more lenses and formed as a single piece organic circuit board or multiple separate organic circuit boards joined together;
• an image sensor attached to the organic PCB and in contact with an image side surface of the organic PCB to communicate electrical signals over conductive traces routed at multiple layers of the organic circuit board or the multiple separate organic circuit boards and to generate image signals based on light passing through the one or more lenses;
• and
• an actuator configured to move the image sensor and the organic PCB relative to the one or more lenses.