H05K 2201/01
Dielectrics
H05K2201/01 (Dielectrics) appears on 7,776 US grants and 8,353 published applications in this corpus.
Search patents in H05K- Granted patents
- 7,776
- Published applications
- 8,353
- Assignees
- 2,351
- Inventors
- 16,164
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 22 | 0 |
| 1977 | 11 | 0 |
| 1978 | 24 | 0 |
| 1979 | 15 | 0 |
| 1980 | 20 | 0 |
| 1981 | 19 | 0 |
| 1982 | 20 | 0 |
| 1983 | 29 | 0 |
| 1984 | 30 | 0 |
| 1985 | 43 | 0 |
| 1986 | 32 | 0 |
| 1987 | 55 | 0 |
| 1988 | 48 | 0 |
| 1989 | 76 | 0 |
| 1990 | 75 | 0 |
| 1991 | 81 | 0 |
| 1992 | 106 | 0 |
| 1993 | 95 | 0 |
| 1994 | 98 | 0 |
| 1995 | 97 | 0 |
| 1996 | 81 | 0 |
| 1997 | 85 | 0 |
| 1998 | 129 | 0 |
| 1999 | 139 | 0 |
| 2000 | 129 | 0 |
| 2001 | 172 | 70 |
| 2002 | 174 | 209 |
| 2003 | 192 | 229 |
| 2004 | 191 | 280 |
| 2005 | 143 | 299 |
| 2006 | 163 | 313 |
| 2007 | 159 | 381 |
| 2008 | 168 | 391 |
| 2009 | 191 | 449 |
| 2010 | 214 | 381 |
| 2011 | 219 | 255 |
| 2012 | 265 | 281 |
| 2013 | 225 | 256 |
| 2014 | 217 | 382 |
| 2015 | 247 | 467 |
| 2016 | 313 | 406 |
| 2017 | 363 | 377 |
| 2018 | 324 | 429 |
| 2019 | 394 | 386 |
| 2020 | 370 | 453 |
| 2021 | 338 | 381 |
| 2022 | 295 | 352 |
| 2023 | 248 | 312 |
| 2024 | 290 | 251 |
| 2025 | 214 | 210 |
| 2026 | 128 | 153 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Camera module29 Sep 2026US 12,750,575 B2LG Innotek Co., Ltd.
- Wiring board22 Sep 2026US 12,745,348 B2KYOCERA Corporation
- Multilayer dielectric substrate and method for manufacturing multilayer dielectric substrate15 Sep 2026US 12,739,968 B2Murata Manufacturing Co., Ltd.
- Methods of forming interconnect circuits methods15 Sep 2026US 12,739,982 B2CelLink Corporation
- Stretchable substrate, and method for manufacturing stretchable substrate8 Sep 2026US 12,733,091 B2Korea Photonics Technology Institute
- Organic fiber fabric and uses of the same8 Oct 2026US 2026/0308839 A1
- Stepped trace design for impedance compensation of high-speed differential pair channels8 Oct 2026US 2026/0313784 A1Advanced Micro Devices, Inc.
- Flexible circuit board and manufacturing method therefor8 Oct 2026US 2026/0313789 A1Pomiran Metalization Research Co., Ltd.
- Flexible and stretchable structures8 Oct 2026US 2026/0313807 A1Liquid Wire Inc.
- Transparent article with electrically-conductive pattern8 Oct 2026US 2026/0313810 A1Eastman Kodak Company
Most cited
By later US patents
- Flex circuit connector916US 5,482,473 AMiniMed Inc. · 1996
- Thin film electrical component781US 5,108,819 AEli Lilly and Company · 1992
- Fold flex circuit for LNOP540US 10,327,337 B2Masimo Corporation · 2019
- Microelectronic mounting with multiple lead deformation and bonding475US 5,518,964 ATessera, Inc. · 1996
- Method of making a thin film electrical component396US 5,403,700 AEli Lilly and Company · 1995