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US 2026/0313807 A1Published application
Flexible and stretchable structures
AssigneeLiquid Wire Inc.
InventorsTrevor Antonio Rivera, Michael Adventure Hopkins, Mark William Ronay
Life of this patent
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Abstract
Devices, systems, and methods include a substrate layer, a metal layer coupled to the substrate layer, an encapsulant coupled to the substrate layer and the metal layer, and a stencil-in-place structure. The encapsulant is configured to electrically isolate the metal layer from environmental conditions. The stencil-in-place structure includes a stencil substrate and conductive gel secured within a channel and a via formed by the stencil substrate, the conductive gel electrically coupled to the metal layer.
Claims19
An apparatus, comprising:
- a substrate layer;
- a metal layer coupled to a major surface of the substrate layer, the metal layer patterned to define a conductive trace and a contact pad;
- a first via extending through the substrate layer from the contact pad;
- a fluid phase conductor disposed in the first via and electrically coupled to the contact pad;
- and
- an encapsulant coupled to the substrate layer and the metal layer and configured to electrically isolate the metal layer from environmental conditions.
3 more elements
An apparatus, comprising:
- a substrate layer;
- a metal layer coupled to the substrate layer;
- an electronic component;
- a via extending through the substrate layer and containing a fluid phase conductor that electrically couples the electronic component to the metal layer;
- and
- an encapsulant coupled to the substrate layer and the metal layer and configured to electrically isolate the metal layer from environmental conditions,
- wherein the fluid phase conductor comprises a conductive gel including a eutectic gallium alloy and gallium oxide.
4 more elements
Dependencies are inferred from the claim text.