Back to results
US 12,739,968 B2Granted
Multilayer dielectric substrate and method for manufacturing multilayer dielectric substrate
AssigneeMurata Manufacturing Co., Ltd.
InventorNorikazu Fujii
Life of this patent
Estimating the term…
Abstract
A method includes after application of a bonding material, such as a metal paste, on a second dielectric substrate, a first dielectric substrate with a recess formed therein is laminated on the second dielectric substrate. Thereafter, the bonding material is sintered to form a cavity inside the dielectric substrate.
Claims18
A method for manufacturing a multilayer dielectric substrate, the method comprising:
- arranging a first dielectric substrate having a first multilayer structure, the first multilayer structure including a plurality of laminated dielectric layers, at least one first electrode, and a first recess formed to extend through at least some of the plurality of laminated dielectric layers and to at least partially overlap the at least one first electrode in a lamination direction;
- arranging a second dielectric substrate having a second multilayer structure with a second electrode, so the first recess is positioned between the at least one first electrode and the second electrode;
- and constituting at least a portion of a radio frequency circuit in which a first cavity is formed from the first recess being positioned between the at least one first electrode and the second electrode, the constituting including bonding the first dielectric substrate and the second dielectric substrate via a bonding material different from a material of the first dielectric substrate and the second dielectric substrate;
- wherein the at least one first electrode is a radiation electrode, the second electrode is a ground electrode, and a feed point of the radiation electrode is connected to a feeder inside a via extending in a lamination direction of the multilayer dielectric substrate, the via extending from the radiation electrode through the ground electrode to contact an RFIC on a bottom of the second dielectric substrate, the RFIC being external with respect to the second dielectric substrate.
1 more element
A multilayer dielectric substrate, comprising:
- a first dielectric substrate having a first multilayer structure, the first multilayer structure including a plurality of laminated dielectric layers, at least one first electrode, and a first recess extending through at least some of the plurality of laminated dielectric layers and positioned to at least partially overlap the at least one first electrode in a lamination direction;
- a second dielectric substrate having a second multilayer structure, the second multilayer structure including a plurality of laminated dielectric layers and a second electrode;
- and
- a bonding material that bonds the first dielectric substrate and the second dielectric substrate in a state where the first recess is present between the at least one first electrode and the second electrode so as to constitute at least a portion of a radio frequency circuit in which a first cavity that includes the first recess is between the at least one first electrode and the second electrode, wherein the bonding material is different from a material comprising the first dielectric substrate and the second dielectric substrate;
- wherein the at least one first electrode is a radiation electrode, the second electrode is a ground electrode, and a feed point of the radiation electrode is connected to a feeder inside a via extending in a lamination direction of the multilayer dielectric substrate, the via extending from the radiation electrode through the ground electrode to contact an RFIC on a bottom of the second dielectric substrate, the RFIC being external with respect to the second dielectric substrate.
2 more elements
Dependencies are inferred from the claim text.