H05K 2201/0137
Materials
H05K2201/0137 (Materials) appears on 3,449 US grants and 3,878 published applications in this corpus.
Search patents in H05K- Granted patents
- 3,449
- Published applications
- 3,878
- Assignees
- 1,304
- Inventors
- 8,086
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 12 | 0 |
| 1977 | 7 | 0 |
| 1978 | 8 | 0 |
| 1979 | 5 | 0 |
| 1980 | 7 | 0 |
| 1981 | 8 | 0 |
| 1982 | 6 | 0 |
| 1983 | 13 | 0 |
| 1984 | 14 | 0 |
| 1985 | 21 | 0 |
| 1986 | 16 | 0 |
| 1987 | 30 | 0 |
| 1988 | 21 | 0 |
| 1989 | 41 | 0 |
| 1990 | 38 | 0 |
| 1991 | 41 | 0 |
| 1992 | 62 | 0 |
| 1993 | 53 | 0 |
| 1994 | 52 | 0 |
| 1995 | 55 | 0 |
| 1996 | 27 | 0 |
| 1997 | 37 | 0 |
| 1998 | 59 | 0 |
| 1999 | 49 | 0 |
| 2000 | 44 | 0 |
| 2001 | 65 | 26 |
| 2002 | 67 | 82 |
| 2003 | 60 | 72 |
| 2004 | 59 | 100 |
| 2005 | 49 | 122 |
| 2006 | 59 | 145 |
| 2007 | 68 | 199 |
| 2008 | 65 | 169 |
| 2009 | 74 | 182 |
| 2010 | 92 | 156 |
| 2011 | 82 | 100 |
| 2012 | 100 | 120 |
| 2013 | 85 | 102 |
| 2014 | 77 | 140 |
| 2015 | 93 | 222 |
| 2016 | 129 | 170 |
| 2017 | 153 | 169 |
| 2018 | 138 | 211 |
| 2019 | 178 | 195 |
| 2020 | 179 | 259 |
| 2021 | 187 | 221 |
| 2022 | 164 | 209 |
| 2023 | 149 | 166 |
| 2024 | 167 | 146 |
| 2025 | 126 | 122 |
| 2026 | 58 | 73 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2201/0154PolyimideIndexing code1,497
- H05K 2201/0141Liquid crystal polymer [lcp]Indexing code481
- H05K 2201/015FluoropolymerIndexing code471
- H05K 2201/0145PolyesterIndexing code439
- H05K 2201/0175Inorganic, non-metallic layerIndexing code321
- H05K 2201/0162Silicon containing polymerIndexing code298
- H05K 2201/0179Thin film deposited insulating layerIndexing code273
- H05K 2201/0158Polyalkene or polyolefinIndexing code211
Recent patents
- Camera module29 Sep 2026US 12,750,575 B2LG Innotek Co., Ltd.
- Wiring board22 Sep 2026US 12,745,348 B2KYOCERA Corporation
- Methods of forming interconnect circuits methods15 Sep 2026US 12,739,982 B2CelLink Corporation
- Stretchable substrate, and method for manufacturing stretchable substrate8 Sep 2026US 12,733,091 B2Korea Photonics Technology Institute
- Flexible printed board and flexible printed board connection structure8 Sep 2026US 12,733,096 B2Mektec Corporation
- Organic fiber fabric and uses of the same8 Oct 2026US 2026/0308839 A1
- Flexible circuit board and manufacturing method therefor8 Oct 2026US 2026/0313789 A1Pomiran Metalization Research Co., Ltd.
- Flexible laminate material1 Oct 2026US 2026/0295973 A1The Chemours Company Fc, LLC
- Wiring board1 Oct 2026US 2026/0304612 A1KYOCERA Corporation
- Outdoor printed board material and manufacturing method therefor1 Oct 2026US 2026/0304613 A1Resonac Corporation
Most cited
By later US patents
- Thin film electrical component781US 5,108,819 AEli Lilly and Company · 1992
- Fold flex circuit for LNOP540US 10,327,337 B2Masimo Corporation · 2019
- Method of making a thin film electrical component396US 5,403,700 AEli Lilly and Company · 1995
- Method for making an electronic module391US 5,745,984 AMartin Marietta Corporation · 1998
- Flexible circuits for electrosurgical instrument378US 10,555,769 B2Ethicon, Inc. · 2020