H05K 2201/0141
Liquid crystal polymer [lcp]
Official title: Liquid crystal polymer [LCP]
H05K2201/0141 (Liquid crystal polymer [lcp]) appears on 481 US grants and 653 published applications in this corpus.
Search patents in H05K- Granted patents
- 481
- Published applications
- 653
- Assignees
- 195
- Inventors
- 1,106
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 6 | 0 |
| 1990 | 3 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 6 | 0 |
| 1998 | 3 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 0 |
| 2002 | 5 | 11 |
| 2003 | 6 | 12 |
| 2004 | 9 | 16 |
| 2005 | 6 | 16 |
| 2006 | 8 | 22 |
| 2007 | 15 | 21 |
| 2008 | 11 | 19 |
| 2009 | 7 | 23 |
| 2010 | 15 | 20 |
| 2011 | 8 | 9 |
| 2012 | 9 | 26 |
| 2013 | 10 | 16 |
| 2014 | 14 | 29 |
| 2015 | 17 | 30 |
| 2016 | 15 | 29 |
| 2017 | 27 | 23 |
| 2018 | 21 | 35 |
| 2019 | 29 | 43 |
| 2020 | 34 | 52 |
| 2021 | 43 | 53 |
| 2022 | 29 | 49 |
| 2023 | 33 | 36 |
| 2024 | 34 | 27 |
| 2025 | 33 | 22 |
| 2026 | 12 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electrical interconnect structure with circuit bearing dielectric layers and resultant dielectric spacing control and circuit pitch reduction8 Sep 2026US 12,733,109 B2
- Antenna module and portable electric device using the same18 Aug 2026US 12,712,254 B2QuantumZ Inc.
- Copper clad laminate and uses of the same28 Jul 2026US 12,696,386 B2Taiwan Union Technology Corporation
- Printed circuit board and substrate including electronic component embedded therein30 Jun 2026US 12,672,231 B2Samsung Electro-Mechanics Co., Ltd.
- Circuit board and multilayer circuit board7 Apr 2026US 12,598,697 B2Murata Manufacturing Co., Ltd.
- Organic fiber fabric and uses of the same8 Oct 2026US 2026/0308839 A1
- Forming a circuit bearing structure with low temperature and pressure during lamination cycle1 Oct 2026US 2026/0304636 A1LCP Medical Technologies, Inc.
- Forming a circuit bearing structure with dielectric ink1 Oct 2026US 2026/0304646 A1LCP Medical Technologies, Inc.
- Prepreg, metal-clad laminate, and wiring board10 Sep 2026US 2026/0264370 A1Panasonic Intellectual Property Management Co., Ltd.
- Liquid crystal polymer dielectric powder or 3d printed material27 Aug 2026US 2026/0255492 A1LCP Medical Technologies, Inc.
Most cited
By later US patents
- Polymer and ceramic composite electronic substrates119US 6,528,145 B1International Business Machines Corporation · 2003
- Multi-layered interconnect structure using liquid crystalline polymer dielectric96US 7,301,108 B2International Business Machines Corporation · 2007
- Flexible electronic structure81US 9,159,635 B2MC10, Inc. · 2015
- Low CTE power and ground planes73US 6,329,603 B1International Business Machines Corporation · 2001
- Monolithic LCP polymer microelectronic wiring modules72US 5,719,354 AHoechst Celanese Corporation · 1998