Forming a circuit bearing structure with dielectric ink
AssigneeLCP Medical Technologies, Inc.
InventorJames Rathburn
Life of this patent
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Abstract
Embodiments for a method of forming a circuit bearing structure are provided. The method includes depositing and curing dielectric ink around circuit features standing proud on a first surface of a first dielectric layer of a substrate, wherein depositing dielectric ink on the first surface includes covering the circuit features with dielectric ink and disposing a second dielectric layer on top of the dielectric ink prior to curing the dielectric ink, such that the dielectric ink is disposed between the first dielectric layer and the second dielectric layer, wherein curing the dielectric ink bonds the second dielectric layer to the first dielectric layer.
Claims13
A method of forming a circuit bearing structure, the method comprising:
- providing a substrate having a first dielectric layer defining a first surface and circuit features standing proud on the first surface;
- depositing dielectric ink on the first surface around the circuit features;
- and
- curing the dielectric ink.
A method of forming a circuit bearing structure, the method comprising:
- printing dielectric ink on a base, wherein printing forms a dielectric layer on the base, the dielectric layer defining one or more recesses therein;
- and
- depositing an electrically conductive material in the one or more recesses to form circuit features in the dielectric layer.
Dependencies are inferred from the claim text.