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US 12,672,231 B2Granted
Printed circuit board and substrate including electronic component embedded therein
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsDae Jung Byun, Mi Sun Hwang, Jung Soo Kim, Jin Won Lee, Duck Young Maeng
Life of this patent
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Abstract
A printed circuit board includes a first insulating layer having a first modulus; a second insulating layer disposed on the first insulating layer and having a second modulus; and a cavity penetrating the second insulating layer, wherein the second modulus is greater than the first modulus, and wherein an edge portion of a bottom surface of the cavity is formed of an insulating material.
Claims13
A printed circuit board, comprising:
- a first insulating layer having a first modulus;
- a first wiring layer;
- a second insulating layer disposed on the first insulating layer and having a second modulus, the second insulating layer comprising a third insulating layer contacting the first insulating layer and a fourth insulating layer disposed on the third insulating layer;
- and
- a cavity penetrating the second insulating layer,
- wherein the first wiring layer includes a first wiring pattern of which at least a portion of one surface exposed from one surface of the first insulating layer is covered by and in contact with the second insulating layer, and a second wiring pattern of which at least a portion of one surface exposed from one surface of the first insulating layer is exposed by the cavity,
- wherein the first wiring pattern includes a first conducting via penetrating the third insulating layer and connecting the first wiring pattern to a third wiring layer disposed on or in the third insulating layer, the fourth insulating layer covering at least a portion of a surface of the third wiring layer exposed through the third insulating layer,
- wherein the second modulus is greater than the first modulus,
- wherein an upper surface portion of the first insulating layer forms a bottom surface of the cavity, and is not covered by the second insulating layer in a thickness direction,
- wherein an interface between the first and second insulating layers is coplanar with or lower than an upper surface of the second wiring pattern when viewed in a cross-section view, and
- wherein the second wiring pattern is connected to a conductive via penetrating at least a portion of the first insulating layer.
8 more elements
A printed circuit board, comprising:
- a first insulating body including a first insulating layer having a first etch rate for microblasting and a first wiring layer;
- a second insulating layer having a second etch rate for microblasting, the second etch rate being greater than the first etch rate, the second insulating layer comprising a third insulating layer contacting the first insulating layer and a fourth insulating layer disposed on the third insulating layer;
- and
- a cavity penetrating the second insulating layer and exposing a surface of the first insulating layer;
- wherein the first wiring layer includes a first wiring pattern of which at least a portion of one surface exposed from one surface of the first insulating layer is covered by and in contact with the second insulating layer, and a second wiring pattern of which at least a portion of one surface exposed from one surface of the first insulating layer is exposed by the cavity,
- wherein the first wiring pattern includes a first conducting via penetrating the third insulating layer and connecting the first wiring pattern to a third wiring layer disposed on or in the third insulating layer, the fourth insulating layer covering at least a portion of a surface of the third wiring layer exposed through the third insulating layer, and
- wherein an upper surface portion of the first insulating layer forms a bottom surface of the cavity, and is not covered by the second insulating layer in a thickness direction.
4 more elements
Dependencies are inferred from the claim text.