Circuit board and multilayer circuit board
AssigneeMurata Manufacturing Co., Ltd.
InventorsTakayuki Shimamura, Tomohiro Furumura, Sunao Fukutake
Life of this patent
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Abstract
A circuit board includes, in order in a stacking direction, a first insulating layer, a second insulating layer in contact with the first insulating layer, and a conductor layer, the first insulating layer includes a liquid crystal polymer as a main component, and the second insulating layer includes a fluoropolymer including at least one of polytetrafluoroethylene and a perfluoroalkoxy alkane and includes a polyimide resin with an imidization rate of about 90% or more, the polyimide resin being present in an amount of about 0.5 parts or more by weight and less than about 20 parts by weight per 100 parts by weight of the fluoropolymer.
Claims21
A circuit board comprising, in order in a stacking direction:
- a first insulating layer;
- a second insulating layer in contact with the first insulating layer;
- and
- a conductor layer;
- wherein
- the first insulating layer includes a liquid crystal polymer as a main component;
- the second insulating layer includes a fluoropolymer including at least one of polytetrafluoroethylene and a perfluoroalkoxy alkane and includes a polyimide resin with an imidization rate of about 90% or more, the polyimide resin being present in an amount of about 0.5 parts or more by weight and less than about 20 parts by weight per 100 parts by weight of the fluoropolymer;
- the polyimide resin is a solvent-soluble polyimide resin;
- and
- the second insulating layer is in direct contact with the conductor.
Dependencies are inferred from the claim text.