Liquid crystal polymer dielectric powder or 3d printed material
AssigneeLCP Medical Technologies, Inc.
InventorJames RATHBURN
Life of this patent
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Abstract
Embodiments for a method of forming a circuit bearing structure are provided. The method includes depositing a layer of thermoplastic particles on a surface, pressing and heating the layer of thermoplastic particles to create a contiguous thermoplastic film, and forming one or more circuit structures in the contiguous thermoplastic film.
Claims18
A method of forming a circuit bearing structure, the method comprising:
- depositing a layer of thermoplastic particles on a surface;
- pressing and heating the layer of thermoplastic particles to create a contiguous thermoplastic film;
- and
- forming one or more circuit structures in the contiguous thermoplastic film.
A method of forming a circuit bearing structure, the method comprising providing a thermoplastic substrate having one or more circuit structures formed therein and exposed at a first surface thereof;
- depositing a layer of thermoplastic particles on the first surface;
- and
- pressing and heating the layer of thermoplastic particles to create a contiguous thermoplastic material including the thermoplastic substrate and the layer of thermoplastic particles.
A method of forming a circuit bearing structure, the method comprising
- providing a thermoplastic substrate having one or more circuit structures formed therein and exposed at a first surface thereof;
- depositing a layer of particles on the first surface, the layer of particles including particles of a thermoplastic material and particles of a photo-imageable material;
- exposing the layer of particles to masked UV light to cure portions of the layer of particles and leave other areas of the particles uncured;
- removing uncured particles from the first surface forming one or more recesses therein;
- depositing copper in the one or more recesses.
Dependencies are inferred from the claim text.