Copper clad laminate and uses of the same
AssigneeTaiwan Union Technology Corporation
InventorsJui-Hsiang Tang, Yun Hsing Sung
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Abstract
A copper clad laminate is provided. The copper clad laminate includes a dielectric layer; an adhesive layer, which is disposed on at least one side of the dielectric layer and formed of an adhesive material, wherein the adhesive material includes a non-perfluorinated resin; and a copper foil, wherein the copper foil has a first surface and is disposed on the other side of the adhesive layer opposite to the dielectric layer, and the copper foil is adhered to the adhesive layer with the first surface, wherein the first surface has a ten-point average roughness (Rz) of less than 0.5 μm, and the copper foil has a phosphorus content of no more than 499 μg/dm2 at the first surface.
Claims17
A copper clad laminate, which comprises:
- a dielectric layer;
- an adhesive layer, which is disposed on at least one side of the dielectric layer and formed of an adhesive material, wherein the adhesive material comprises a non-perfluorinated resin;
- and
- a copper foil, wherein the copper foil has a first surface and is disposed on the other side of the adhesive layer opposite to the dielectric layer, and wherein the copper foil is adhered to the adhesive layer with the first surface,
- wherein the first surface has a ten-point average roughness (Rz) of less than 0.5 μm, and the copper foil is electroplated in such a way that the copper foil has a phosphorus content of no more than 499 μg/dm2 at the first surface.
Dependencies are inferred from the claim text.