Low CTE power and ground planes

A power/ground core for use in printed circuit boards, the power/ground core comprising:

• at least one layer of fiber laminate;
• and
• at least one layer of conductive material, the conductive material having a coefficient of thermal expansion (CTE) that is lower than the CTE of a copper plane, wherein the
• at least one layer of fiber laminate is conductive.

A power/ground core for use in printed circuit boards, the power/ground core comprising:

• at least one layer of fiber laminate;
• and
• at least one layer of conductive material, the conductive material having a coefficient of thermal expansion (CTE) that is lower than the CTE of a copper plane, wherein the
• conductive material comprises a metal-clad carbon or graphite sheet.

A power/ground core for use in printed circuit boards, the power/ground core comprising:

• at least one layer of fiber laminate;
• and
• at least one layer of conductive material, the conductive material having a coefficient of thermal expansion (CTE) that is lower than the CTE of a copper plane, wherein the
• conductive material comprises metal-coated fibrous material woven into a fabric or formed into random paper fabric.

A printed circuit board (PCB), the PCB comprising:

• at least one signal core, each signal core comprising at least one signal layer and at least one layer of fiber laminate;
• and
• at least one power/ground core comprising:
• at least one layer of fiber laminate;
• and
• at least one layer of conductive material, the conductive material having a coefficient of thermal expansion (CTE) that is lower than the CTE of a copper plane, and wherein the conductive material comprises metal-coated fibrous material woven into a fabric or formed into random paper fabric.

A printed circuit board (PCB), the PCB comprising:

• at least one signal core, each signal core comprising at least one signal layer and at least one layer of fiber laminate;
• and
• at least one power/ground core comprising:
• at least one layer of fiber laminate;
• and
• at least one layer of conductive material, the conductive material having a coefficient of thermal expansion (CTE) that is lower than the CTE of a copper plane, wherein the CTE of the conductive material is less than 5 PPM/C.

A printed circuit board (PCB), the PCB comprising:

• at least one signal core, each signal core comprising at least one signal layer and at least one layer of fiber laminate;
• and
• at least one power/ground core comprising:
• at least one layer of fiber laminate;
• and
• at least one layer of conductive material, the conductive material having a coefficient of thermal expansion (CTE) that is lower than the CTE of a copper plane, wherein the conductive material comprises a metal-clad carbon or graphite sheet.