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AssigneesHoechst Celanese Corporation, Kuraray Co., Ltd.
InventorsRandy Douglas Jester, Edwin Charles Culbertson, Detlef M. Frank, Sherman Hall Rounsville, John Arthur Penoyer, Takeichi Tsugaka, Minoru Onodera, Toshiaki Sato, Toru Sanefuji
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The invention provides a multilayer microelectronic circuit board including a laminate of a plurality of circuit layers containing conductive vias within the layers or a combination of conductive vias and conductive wiring patterns on a surface of the layers, the layers comprising a first liquid crystal polymer and, interposed between said circuit layers, a layer of second liquid crystal polymer having a melting point of at least about 10.degree. C. lower than the melting point of the first liquid crystal polymer. The boards are produced by stacking a plurality of circuit layer sheets in appropriate electrical alignment such that they are separated by an interposed layer of the second liquid crystal polymer of lower melting point, and heating the stacked polymer sheets under pressure sufficient to bond the sheets or layers into a microelectronic printed circuit board, the temperature of the heating being sufficient to melt the lower melting second polymer but insufficient to melt the polymer present in the circuit layers. The second polymer layer may be interposed as a separate sheet during assembly or may be present as one or two separate surface layers in contact with the higher melting point polymer of the circuit layers.
A multilayer microelectronic printed circuit board comprising a laminate of a plurality of circuit layers selected from the group consisting of circuit layers containing conductive vias within the layers, conductive wiring patterns on one surface of the layers, conductive wiring patterns on both surfaces of the layers, and a combination of conductive vias and conductive wiring patterns on the surfaces of the layers, said circuit layers comprising a first liquid crystal polymer, and interposed between said circuit layers an adhesive layer comprising a second liquid crystal polymer having melting point of at least about 10.degree. C. lower than the melting point of said first liquid crystal polymer.
Dependencies are inferred from the claim text.