H05K 2201/0158
Polyalkene or polyolefin
Official title: Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
H05K2201/0158 (Polyalkene or polyolefin) appears on 211 US grants and 215 published applications in this corpus.
Search patents in H05K- Granted patents
- 211
- Published applications
- 215
- Assignees
- 164
- Inventors
- 607
- Latest grant
- 14 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 5 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 5 | 0 |
| 1997 | 0 | 0 |
| 1998 | 6 | 0 |
| 1999 | 7 | 0 |
| 2000 | 4 | 0 |
| 2001 | 7 | 0 |
| 2002 | 2 | 4 |
| 2003 | 2 | 5 |
| 2004 | 2 | 2 |
| 2005 | 2 | 3 |
| 2006 | 1 | 4 |
| 2007 | 1 | 7 |
| 2008 | 2 | 12 |
| 2009 | 2 | 12 |
| 2010 | 3 | 16 |
| 2011 | 9 | 7 |
| 2012 | 12 | 4 |
| 2013 | 11 | 4 |
| 2014 | 6 | 9 |
| 2015 | 1 | 11 |
| 2016 | 10 | 11 |
| 2017 | 11 | 12 |
| 2018 | 12 | 18 |
| 2019 | 10 | 8 |
| 2020 | 16 | 19 |
| 2021 | 13 | 13 |
| 2022 | 11 | 10 |
| 2023 | 8 | 8 |
| 2024 | 9 | 2 |
| 2025 | 3 | 8 |
| 2026 | 1 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of manufacturing a formed film14 Apr 2026US 12,604,397 B2Canatu Oy
- Organic insulator and wiring board2 Sep 2025US 12,408,268 B2KYOCERA Corporation
- Trim element comprising a functional layer made of carbon material1 Apr 2025US 12,263,795 B2Faurecia Interieur Industrie
- Room-temperature-curable polybutadiene resin composition, method for producing same, and packaged circuit board21 Jan 2025US 12,202,930 B2Shin-Etsu Chemical Co., Ltd.
- Flexible wiring board31 Dec 2024US 12,185,458 B2Murata Manufacturing Co., Ltd.
- Method for producing cyclic olefin copolymer, cyclic olefin copolymer, crosslinked product, film, or sheet, laminate, circuit board, electronic device, and prepreg3 Sep 2026US 2026/0258173 A1Mitsui Chemicals, Inc.
- Circuit board and method of manufacturing circuit board7 May 2026US 2026/0129754 A1Sumitomo Electric Industries, Ltd.
- Curable resin composition, dry film, cured product, and printed wiring board30 Apr 2026US 2026/0122792 A1Taiyo Holdings Co., Ltd.
- Base material for mounting electronic device26 Mar 2026US 2026/0089839 A1Toyo Seikan Group Holdings, Ltd.
- Printed circuit board26 Feb 2026US 2026/0059657 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Prepreg for printed circuit board and substrate for printed circuit using said prepreg82US 5,733,823 AIdemitsu Petrochemical Co., Ltd. · 1998
- Low CTE power and ground planes73US 6,329,603 B1International Business Machines Corporation · 2001
- Low Dielectric constant materials for high speed electronics70US 5,576,517 AGeneral Electric Company · 1996
- Adhesive-filler film composite64US 5,879,794 AW. L. Gore & Associates, Inc. · 1999
- Multilayer print circuit board having a blind hole in an insulation layer with a roughened surface formed by application of an oxidizing agent and method of production61US 6,127,633 AVictor Company of Japan, Ltd. · 2000