Room-temperature-curable polybutadiene resin composition, method for producing same, and packaged circuit board

A room-temperature-curable polybutadiene resin composition comprising:

• (A) a urethane oligomer having OH groups respectively at both ends of the molecular chain thereof comprising a polycondensate of (A1) a polybutadiene having OH groups respectively at both ends of the molecular chain thereof and (A2) a diisocyanate compound;
• (B) a hydrolyzable organosilane compound having on the average at least 2 silicon-bonded hydrolyzable groups per molecule and not having 3 or more nitrogen atoms per molecule and/or a partial hydrolytic condensate thereof, wherein the hydrolyzable organosilane compound is a tetraalkoxysilane, ketoximesilane, organoalkoxysilane, alkenoxysilane, or acetoxysilane, wherein the organoalkoxysilane is methyltrimethoxysilane, vinyltrimethoxysilane, phenyltrimethoxysilane, methyltriethoxysilane, vinyltriethoxysilane, n-propyltrimethoxysilane, n-hexyltrimethoxysilane, n-decyltrimethoxysilane, 1,6-bistrimethoxysilylhexane, dimethyldimethoxysilane, vinyldimethoxymethylsilane or dimethyldiethoxysilane;
• (C) a condensation reaction catalyst;
• and
• (D) a hydrolyzable organosilane compound having 3 or more nitrogen atoms per molecule and/or a partial hydrolytic condensate thereof.