Low Dielectric constant materials for high speed electronics
AssigneeGeneral Electric Company
InventorsRobert J. Wojnarowski, Herbert S. Cole, Theresa A. Sitnik-Nieters, Wolfgang Daum
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Abstract
An electronic structure includes a circuit chip having chip pads and supported by a substrate, and a low dielectric constant porous polymer layer having pores and situated over the substrate and circuit chip. The porous polymer layer has at least one via therein aligned with at least one of the chip pads, and a pattern of electrical conductors extends over a portion of the porous polymer layer and into the at least one via. The pattern of electrical conductors does not significantly protrude into the pores of the porous polymer layer.
Claims6
A structure, comprising:
- a substrate;
- a circuit chip having chip pads and supported by the substrate;
- a low dielectric constant uniformly porous polymer layer over the substrate and circuit chip, the porous polymer layer having pores, the porous polymer layer having at least one via therein aligned with at least one of the chip pads;
- and
- a pattern of electrical conductors extending over a portion of the porous polymer layer and into the at least one via, the pattern of electrical conductors not significantly protruding into the pores of the porous polymer layer.
Dependencies are inferred from the claim text.