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US 2026/0089839 A1Published application
Base material for mounting electronic device
AssigneeToyo Seikan Group Holdings, Ltd.
InventorsShinpei OKUYAMA, Yusuke OBU, Kenji HAYASHI
Life of this patent
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Abstract
A base material for mounting an electronic device, the base material including a metal foil, a hygroscopic layer, and a barrier sheet laminated in this order, in which the metal foil has a thickness of from 5 to 20 μm.
Claims11
A base material for mounting an electronic device, the base material comprising a metal foil (A), a hygroscopic layer, and a barrier sheet laminated in this order, wherein
- the metal foil (A) has a thickness of from 5 to 20 μm.
Dependencies are inferred from the claim text.