Curable resin composition, dry film, cured product, and printed wiring board

Abstract

The present invention provides a curable resin composition comprising a polyphenylene ether resin, which can simultaneously achieve excellent storage stability, excellent adhesion between the cured product and a conductor layer at high temperatures, and excellent dielectric properties of the cured product. In a curable resin composition comprising a polyphenylene ether resin, a styrene-based elastomer resin, and a polymerization initiator, a styrene-based elastomer resin having a soft segment composed of styrene and one or more monomers other than styrene is used as the styrene-based elastomer resin, the melt flow rate of the styrene-based elastomer resin is adjusted to 15.0 g/10 min or less, and the styrene ratio of the styrene-based elastomer resin is adjusted to 65% by mass or more.

Dependencies are inferred from the claim text.