H05K 2201/015
Fluoropolymer
Official title: Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
H05K2201/015 (Fluoropolymer) appears on 471 US grants and 462 published applications in this corpus.
Search patents in H05K- Granted patents
- 471
- Published applications
- 462
- Assignees
- 254
- Inventors
- 1,178
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 9 | 0 |
| 1988 | 8 | 0 |
| 1989 | 12 | 0 |
| 1990 | 9 | 0 |
| 1991 | 9 | 0 |
| 1992 | 11 | 0 |
| 1993 | 8 | 0 |
| 1994 | 15 | 0 |
| 1995 | 14 | 0 |
| 1996 | 7 | 0 |
| 1997 | 12 | 0 |
| 1998 | 17 | 0 |
| 1999 | 11 | 0 |
| 2000 | 7 | 0 |
| 2001 | 7 | 6 |
| 2002 | 11 | 6 |
| 2003 | 6 | 13 |
| 2004 | 5 | 13 |
| 2005 | 8 | 21 |
| 2006 | 12 | 13 |
| 2007 | 5 | 14 |
| 2008 | 11 | 16 |
| 2009 | 9 | 12 |
| 2010 | 9 | 15 |
| 2011 | 4 | 7 |
| 2012 | 7 | 7 |
| 2013 | 3 | 7 |
| 2014 | 4 | 12 |
| 2015 | 6 | 14 |
| 2016 | 12 | 19 |
| 2017 | 13 | 15 |
| 2018 | 12 | 24 |
| 2019 | 17 | 26 |
| 2020 | 20 | 35 |
| 2021 | 24 | 33 |
| 2022 | 22 | 41 |
| 2023 | 26 | 26 |
| 2024 | 25 | 26 |
| 2025 | 20 | 27 |
| 2026 | 9 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Methods of forming interconnect circuits methods15 Sep 2026US 12,739,982 B2CelLink Corporation
- Copper clad laminate and uses of the same28 Jul 2026US 12,696,386 B2Taiwan Union Technology Corporation
- Substrate for printed circuit board and printed circuit board21 Jul 2026US 12,690,128 B2Sumitomo Electric Industries, Ltd.
- Circuit board and multilayer circuit board7 Apr 2026US 12,598,697 B2Murata Manufacturing Co., Ltd.
- Resin composition and metal clad substrate3 Mar 2026US 12,565,582 B2Iteq Corporation
- Organic fiber fabric and uses of the same8 Oct 2026US 2026/0308839 A1
- Flexible laminate material1 Oct 2026US 2026/0295973 A1The Chemours Company Fc, LLC
- Photosensitive resin composition, resin film having pattern, method for producing resin film having pattern, and semiconductor circuit board24 Sep 2026US 2026/0292972 A1Jsr Corporation
- Laminate and method for forming laminate20 Aug 2026US 2026/0241412 A1Daikin Industries, Ltd.
- Resin film, metal-clad laminate, printed wiring board, and method for producing resin film13 Aug 2026US 2026/0233497 A1The University of Osaka
Most cited
By later US patents
- Porous polymeric membrane toughened composites189US 6,737,158 B1Gore Enterprise Holdings, Inc. · 2004
- In situ method for forming a capacitive PCB173US 5,261,153 AZycon Corporation · 1993
- Method of manufacturing a multilayer circuit board138US 5,046,238 ARogers Corporation · 1991
- Strip line cable using a porous, crystalline polymer dielectric tape131US 4,382,236 AJunkosha Inc. · 1983
- Polymer and ceramic composite electronic substrates119US 6,528,145 B1International Business Machines Corporation · 2003