Method of manufacturing a multilayer circuit board
AssigneeRogers Corporation
InventorsRobert Daigle, Samuel Malbaurn, David Noddin
Life of this patent
Estimating the term…
Abstract
Methods of fabricating multilayer circuits are presented. In accordance with the present invention, a plurality of circuit layers comprised of a dielectric substrate having a circuit formed thereon are stacked, one on top of the other. The dielectric substrate is composed of a polymeric material capable of undergoing fusion bonding such as a fluoropolymeric based substrate. Fusible conductive bonding material (e.g. solder) is applied on selected exposed circuit traces (prior to the stacking step) whereupon the entire stack-up is subjected to lamination under heat and pressure to simultaneously fuse all of the substrate and conductive layers together to form an integral multilayer circuit having solid conductive interconnects.
Claims12
A method of making a multilayer circuit comprising the steps of:
- providing at least two circuit boards wherein said first circuit board comprises a first substrate of fusible dielectric material and a first conductive circuit formed thereon and said second circuit board comprises a second substrate of fusible dielectric material and a second conductive circuit formed thereon and wherein at least said first conductive circuit includes fusible conductive material provided on at least one selected location thereof;
- stacking said at least two circuit boards one on top of the other so that said fusible conductive material on said first circuit aligns with a selected location on said second circuit;
- laminating said stacked circuit boards under heat and pressure effective to fuse both said fusible dielectric material and said fusible conductive material so as to form a cohesive multilayer circuit having a solid conductive interconnect between said first and second circuits, said solid conductive interconnect being defined by said fusible conductive material.
Dependencies are inferred from the claim text.