Resin film, metal-clad laminate, printed wiring board, and method for producing resin film

Abstract

An object of the present invention is to provide a resin film and a metal-clad laminate that can be used to produce a printed wiring board having excellent dimensional stability and reduced transmission loss. Another object of the present invention is to provide a method for producing a resin film that can be used to produce a printed wiring board having excellent dimensional stability and reduced transmission loss. The present invention relates to a resin film 7 including a polyimide film 70 and a PTFE film 71 that is directly laminated on the polyimide film 70. In the resin film 7, the peel strength when the PTFE film 71 is peeled off is 0.5 N/mm or more.

Dependencies are inferred from the claim text.