H05K 2201/0154
Polyimide
H05K2201/0154 (Polyimide) appears on 1,497 US grants and 1,691 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,497
- Published applications
- 1,691
- Assignees
- 672
- Inventors
- 3,884
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 3 | 0 |
| 1985 | 8 | 0 |
| 1986 | 5 | 0 |
| 1987 | 17 | 0 |
| 1988 | 9 | 0 |
| 1989 | 16 | 0 |
| 1990 | 18 | 0 |
| 1991 | 20 | 0 |
| 1992 | 38 | 0 |
| 1993 | 30 | 0 |
| 1994 | 26 | 0 |
| 1995 | 28 | 0 |
| 1996 | 13 | 0 |
| 1997 | 18 | 0 |
| 1998 | 29 | 0 |
| 1999 | 23 | 0 |
| 2000 | 24 | 0 |
| 2001 | 34 | 12 |
| 2002 | 29 | 28 |
| 2003 | 26 | 30 |
| 2004 | 23 | 46 |
| 2005 | 13 | 51 |
| 2006 | 23 | 43 |
| 2007 | 25 | 86 |
| 2008 | 16 | 61 |
| 2009 | 16 | 74 |
| 2010 | 21 | 53 |
| 2011 | 23 | 33 |
| 2012 | 32 | 54 |
| 2013 | 31 | 45 |
| 2014 | 28 | 48 |
| 2015 | 31 | 87 |
| 2016 | 56 | 86 |
| 2017 | 63 | 80 |
| 2018 | 70 | 94 |
| 2019 | 78 | 88 |
| 2020 | 92 | 137 |
| 2021 | 94 | 109 |
| 2022 | 89 | 119 |
| 2023 | 80 | 84 |
| 2024 | 80 | 72 |
| 2025 | 62 | 46 |
| 2026 | 26 | 25 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Methods of forming interconnect circuits methods15 Sep 2026US 12,739,982 B2CelLink Corporation
- Stretchable substrate, and method for manufacturing stretchable substrate8 Sep 2026US 12,733,091 B2Korea Photonics Technology Institute
- Flexible printed board and flexible printed board connection structure8 Sep 2026US 12,733,096 B2Mektec Corporation
- Polyimide film, high-frequency circuit substrate, and flexible electronic device substrate1 Sep 2026US 12,723,132 B2Ube Corporation
- Eye-tracking system including a ring-shaped printed circuit board having extensions and illumination sources coupled to the extensions18 Aug 2026US 12,710,652 B2Meta Platforms Technologies, LLC
- Organic fiber fabric and uses of the same8 Oct 2026US 2026/0308839 A1
- Flexible circuit board and manufacturing method therefor8 Oct 2026US 2026/0313789 A1Pomiran Metalization Research Co., Ltd.
- Outdoor printed board material and manufacturing method therefor1 Oct 2026US 2026/0304613 A1Resonac Corporation
- Photosensitive resin composition, resin film having pattern, method for producing resin film having pattern, and semiconductor circuit board24 Sep 2026US 2026/0292972 A1Jsr Corporation
- Multilayer substrate3 Sep 2026US 2026/0262159 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Thin film electrical component781US 5,108,819 AEli Lilly and Company · 1992
- Fold flex circuit for LNOP540US 10,327,337 B2Masimo Corporation · 2019
- Method of making a thin film electrical component396US 5,403,700 AEli Lilly and Company · 1995
- Method for making an electronic module391US 5,745,984 AMartin Marietta Corporation · 1998
- Flexible circuits for electrosurgical instrument378US 10,555,769 B2Ethicon, Inc. · 2020